Assignee
SAMPO SEMICONDUCTOR CORP
TW·4 granted patents·193 citations·filing 1998–1998
Technology mixH10W4
Top patents by PatentIndex Score
4 records- 0191US6201302B1Semiconductor package having multi-diesSAMPO SEMICONDUCTOR CORP·Filed 1998·Granted Mar 13, 2001·155 cites·18 claims
- 0258US5973407AIntegral heat spreader for semiconductor packageSAMPO SEMICONDUCTOR CORP·Filed 1998·Granted Oct 26, 1999·28 cites·2 claims
- 0333US6101101AUniversal leadframe for semiconductor devicesSAMPO SEMICONDUCTOR CORP·Filed 1998·Granted Aug 8, 2000·7 cites·1 claims
- 0431US5998857ASemiconductor packaging structure with the bar on chipSAMPO SEMICONDUCTOR CORP·Filed 1998·Granted Dec 7, 1999·3 cites·3 claims
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