Assignee
RAYTECH INNOVATIVE SOLUTIONS I
US·4 granted patents·92 citations·filing 2002–2003
Top patents by PatentIndex Score
4 records- 0186US6875077B2Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of makingRAYTECH INNOVATIVE SOLUTIONS I·Filed 2003·Granted Apr 5, 2005·30 cites·14 claims
- 0285US6852020B2Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making sameRAYTECH INNOVATIVE SOLUTIONS I·Filed 2003·Granted Feb 8, 2005·38 cites·29 claims
- 0378US6899610B2Retaining ring with wear pad for use in chemical mechanical planarizationRAYTECH INNOVATIVE SOLUTIONS I·Filed 2002·Granted May 31, 2005·19 cites·40 claims
- 0451US6863774B2Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making sameRAYTECH INNOVATIVE SOLUTIONS I·Filed 2002·Granted Mar 8, 2005·5 cites·1 claims
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