Assignee
POLY CIRCUITS INC
US·4 granted patents·122 citations·filing 1988–1994
Top patents by PatentIndex Score
4 records- 0175US4854040AMethod of making multilayer pc board using polymer thick filmsPOLY CIRCUITS INC·Filed 1988·Granted Aug 8, 1989·36 cites·10 claims
- 0272US5366027ACircuit board having a bonded metal supportPOLY CIRCUITS INC·Filed 1993·Granted Nov 22, 1994·31 cites·11 claims
- 0371US5432303AConductive adhesive for use in a circuit boardPOLY CIRCUITS INC·Filed 1994·Granted Jul 11, 1995·29 cites·3 claims
- 0467US5210941AMethod for making circuit board having a metal supportPOLY CIRCUITS INC·Filed 1991·Granted May 18, 1993·26 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when POLY CIRCUITS INC files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →