Assignee
PICTA TECHNOLOGY INC
TW·1 granted patent·2 pending applications·19 citations·filing 2002–2002
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0168US6492196B1Packaging process for wafer level IC devicePICTA TECHNOLOGY INC·Filed 2002·Granted Dec 10, 2002·19 cites·8 claims
- 0231US2003134451A1Structure and process for packaging back-to-back chipsPICTA TECHNOLOGY INC·Filed 2002·Application pending·0 cites
- 0322US2003127719A1Structure and process for packaging multi-chipPICTA TECHNOLOGY INC·Filed 2002·Application pending·0 cites
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