Assignee
PARTRIDGE AARON
US·5 granted patents·6 pending applications·21 citations·filing 2006–2013
Top patents by PatentIndex Score
11 records- 0194US8871551B2Wafer encapsulated microelectromechanical structure and method of manufacturing samePARTRIDGE AARON·Filed 2006·Granted Oct 28, 2014·20 cites·24 claims
- 0272US8421167B2Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating samePARTRIDGE AARON·Filed 2010·Granted Apr 16, 2013·1 cites·33 claims
- 0359US8623686B2Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating samePARTRIDGE AARON·Filed 2013·Granted Jan 7, 2014·0 cites·12 claims
- 0456US8287956B2Crack and residue free conformal deposited silicon oxide with predictable and uniform etching characteristicsPARTRIDGE AARON·Filed 2009·Granted Oct 16, 2012·0 cites·14 claims
- 0554US9771257B2Electromechanical system having a controlled atmosphere, and method of fabricating samePARTRIDGE AARON·Filed 2011·Granted Sep 26, 2017·0 cites·17 claims
- 0653US2007181962A1Wafer encapsulated microelectromechanical structure and method of manufacturing samePARTRIDGE AARON·Filed 2006·Application pending·0 cites
- 0753US2007170439A1Wafer encapsulated microelectromechanical structure and method of manufacturing samePARTRIDGE AARON·Filed 2006·Application pending·0 cites
- 0853US2007170440A1Wafer encapsulated microelectromechanical structure and method of manufacturing samePARTRIDGE AARON·Filed 2006·Application pending·0 cites
- 0952US2007170529A1Wafer encapsulated microelectromechanical structure and method of manufacturing samePARTRIDGE AARON·Filed 2006·Application pending·0 cites
- 1052US2007170530A1Wafer encapsulated microelectromechanical structure and method of manufacturing samePARTRIDGE AARON·Filed 2006·Application pending·0 cites
- 1151US2007170528A1Wafer encapsulated microelectromechanical structure and method of manufacturing samePARTRIDGE AARON·Filed 2006·Application pending·0 cites
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