Assignee
PARK DONGSAM
KR·7 granted patents·104 citations·filing 2008–2012
Top patents by PatentIndex Score
7 records- 0197US8883561B2Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POPPARK DONGSAM·Filed 2011·Granted Nov 11, 2014·71 cites·33 claims
- 0291US8704365B2Integrated circuit packaging system having a cavityPARK DONGSAM·Filed 2011·Granted Apr 22, 2014·13 cites·10 claims
- 0388US9087701B2Semiconductor device and method of embedding TSV semiconductor die within substrate for vertical interconnect in POPPARK DONGSAM·Filed 2011·Granted Jul 21, 2015·10 cites·18 claims
- 0482US8598034B2Package-on-package system with through vias and method of manufacture thereofPARK DONGSAM·Filed 2012·Granted Dec 3, 2013·4 cites·9 claims
- 0570US8334601B2Package-on-package system with through vias and method of manufacture thereofPARK DONGSAM·Filed 2011·Granted Dec 18, 2012·2 cites·13 claims
- 0667US8110905B2Integrated circuit packaging system with leadframe interposer and method of manufacture thereofPARK DONGSAM·Filed 2008·Granted Feb 7, 2012·4 cites·20 claims
- 0741US8460968B2Integrated circuit packaging system with post and method of manufacture thereofPARK DONGSAM·Filed 2010·Granted Jun 11, 2013·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →