Assignee
PARELEC INC
US·9 granted patents·2 pending applications·943 citations·filing 1997–2007
Top patents by PatentIndex Score
11 records- 0198US6036889AElectrical conductors formed from mixtures of metal powders and metallo-organic decomposition compoundsPARELEC INC·Filed 1998·Granted Mar 14, 2000·299 cites·14 claims
- 0295US6379745B1Low temperature method and compositions for producing electrical conductorsPARELEC INC·Filed 1997·Granted Apr 30, 2002·234 cites·15 claims
- 0395US6274412B1Material and method for printing high conductivity electrical conductors and other components on thin film transistor arraysPARELEC INC·Filed 1999·Granted Aug 14, 2001·232 cites·7 claims
- 0487US7115218B2Low temperature method and composition for producing electrical conductorsPARELEC INC·Filed 2001·Granted Oct 3, 2006·49 cites·18 claims
- 0586US6143356ADiffusion barrier and adhesive for PARMOD™ application to rigid printed wiring boardsPARELEC INC·Filed 1999·Granted Nov 7, 2000·66 cites·11 claims
- 0678US7211205B2High conductivity inks with improved adhesionPARELEC INC·Filed 2003·Granted May 1, 2007·23 cites·23 claims
- 0778US6824603B1Composition and method for printing resistors, capacitors and inductorsPARELEC INC·Filed 2000·Granted Nov 30, 2004·19 cites·18 claims
- 0869US7141185B2High conductivity inks with low minimum curing temperaturesPARELEC INC·Filed 2003·Granted Nov 28, 2006·8 cites·23 claims
- 0969US7014727B2Method of forming high resolution electronic circuits on a substratePARELEC INC·Filed 2003·Granted Mar 21, 2006·13 cites·20 claims
- 1054US2007170403A1High conductivity inks with improved adhesionPARELEC INC·Filed 2007·Application pending·0 cites
- 1154US2007104884A1High conductivity inks with low minimum curing temperaturesPARELEC INC·Filed 2006·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →