Assignee
PANJIT INT INC
TW·16 granted patents·34 pending applications·1 citations·filing 2020–2024
Top patents by PatentIndex Score
50 records- 0175US11049781B1Chip-scale package devicePANJIT INT INC·Filed 2020·Granted Jun 29, 2021·1 cites·9 claims
- 0263US11916030B2Method for manufacturing side wettable packagePANJIT INT INC·Filed 2022·Granted Feb 27, 2024·0 cites·4 claims
- 0362US12490445B2Fabrication method of forming silicon carbide MOSFETPANJIT INT INC·Filed 2022·Granted Dec 2, 2025·0 cites·9 claims
- 0462US11848254B2Method for manufacturing a semiconductor package having a conductive pad with an anchor flangePANJIT INT INC·Filed 2021·Granted Dec 19, 2023·0 cites·7 claims
- 0562US2025125292A1Side-wettable package with edge-recessed bond padsPANJIT INT INC·Filed 2024·Application pending·0 cites
- 0662US2026090413A1Package with side-wettable structure formed on via wallsPANJIT INT INC·Filed 2024·Application pending·0 cites
- 0761US2025253202A1Semiconductor package with heat-dissipation interfacePANJIT INT INC·Filed 2024·Application pending·0 cites
- 0860US11562947B2Semiconductor package having a conductive pad with an anchor flangePANJIT INT INC·Filed 2020·Granted Jan 24, 2023·0 cites·7 claims
- 0960US11387203B2Side wettable packagePANJIT INT INC·Filed 2020·Granted Jul 12, 2022·0 cites·4 claims
- 1060US2025218927A1Flat packagePANJIT INT INC·Filed 2024·Application pending·0 cites
- 1159US2025239500A1Lamination structure manufactured by laser patterningPANJIT INT INC·Filed 2024·Application pending·0 cites
- 1259US2023261086A1Fabrication method of forming silicon carbide mosfetPANJIT INT INC·Filed 2022·Application pending·0 cites
- 1358US2023261084A1Fabrication method of forming silicon carbide mosfetPANJIT INT INC·Filed 2022·Application pending·0 cites
- 1458US2025201752A1Semiconductor package structure and byproduct of semiconductor componentPANJIT INT INC·Filed 2024·Application pending·0 cites
- 1557US12288737B2Thin semiconductor packaging unit having a plurality of bridging layersPANJIT INT INC·Filed 2022·Granted Apr 29, 2025·0 cites·16 claims
- 1657US12224228B2Packaged component with composite pin structure and manufacturing method thereofPANJIT INT INC·Filed 2022·Granted Feb 11, 2025·0 cites·14 claims
- 1757US2025107117A1Schottky diode with low reverse current and high heat dissipation effectPANJIT INT INC·Filed 2023·Application pending·0 cites
- 1856US12408407B2Metal oxide semiconductor with multiple drain viasPANJIT INT INC·Filed 2022·Granted Sep 2, 2025·0 cites·6 claims
- 1956US2025120008A1Package capable of eliminating bubble formationPANJIT INT INC·Filed 2023·Application pending·0 cites
- 2056US2025112130A1Flat semiconductor package with coplanar leadsPANJIT INT INC·Filed 2023·Application pending·0 cites
- 2156US2024290668A1Semiconductor device without resistance trimming padsPANJIT INT INC·Filed 2023·Application pending·0 cites
- 2255US12568844B2Wafer-level-package device with peripheral side wall protectionPANJIT INT INC·Filed 2023·Granted Mar 3, 2026·0 cites·6 claims
- 2355US2025212372A1Power supply unit with improved space utilization and heat dissipationPANJIT INT INC·Filed 2024·Application pending·0 cites
- 2455US2024355716A1Side-wettable semiconductor package device with heat dissipation surface structurePANJIT INT INC·Filed 2023·Application pending·0 cites
- 2554US12471340B2Manufacturing method of forming semiconductor device and semiconductor devicePANJIT INT INC·Filed 2022·Granted Nov 11, 2025·0 cites·11 claims
- 2654US2025056902A1Solar cell module and method for manufacturing the samePANJIT INT INC·Filed 2024·Application pending·0 cites
- 2753US2024355703A1Heat dissipative semiconductor packagePANJIT INT INC·Filed 2023·Application pending·0 cites
- 2852US2024030155A1Wafer level chip scale package unitPANJIT INT INC·Filed 2022·Application pending·0 cites
- 2952US2025239499A1Ultra-thin packaged componentPANJIT INT INC·Filed 2024·Application pending·0 cites
- 3052US2024112943A1Die suction assistance devicePANJIT INT INC·Filed 2022·Application pending·0 cites
- 3152US2025323171A1Side wettable semiconductor package with probe marksPANJIT INT INC·Filed 2024·Application pending·0 cites
- 3252US2024128185A1Semiconductor device and pre-forming adaptor thereofPANJIT INT INC·Filed 2022·Application pending·0 cites
- 3352US2023187537A1Method of forming power semiconductor devicePANJIT INT INC·Filed 2021·Application pending·0 cites
- 3452US2024120385A1Semiconductor device and manufacturing method thereofPANJIT INT INC·Filed 2022·Application pending·0 cites
- 3551US11664345B2Semiconductor package elementPANJIT INT INC·Filed 2021·Granted May 30, 2023·0 cites·6 claims
- 3651US2024387350A1Package with embedded tracesPANJIT INT INC·Filed 2023·Application pending·0 cites
- 3751US2024120241A1Packaging device capable of detecting risk of impact of electrostatic chargesPANJIT INT INC·Filed 2022·Application pending·0 cites
- 3851US2023378254A1Semiconductor device and manufacturing method thereofPANJIT INT INC·Filed 2022·Application pending·0 cites
- 3951US2024310412A1Universal probe card and testing methodPANJIT INT INC·Filed 2023·Application pending·0 cites
- 4050US12527022B2Heterostructure field effect transistor (HFET) device including controllable dual carrier flow current channelPANJIT INT INC·Filed 2022·Granted Jan 13, 2026·0 cites·7 claims
- 4148US2025069974A1Wafer level packaging component having side wettable structurePANJIT INT INC·Filed 2023·Application pending·0 cites
- 4247US11594425B2Semiconductor package structure and fabricating method of the samePANJIT INT INC·Filed 2020·Granted Feb 28, 2023·0 cites·8 claims
- 4347US2023307528A1Manufacturing method of forming semiconductor device and semiconductor devicePANJIT INT INC·Filed 2022·Application pending·0 cites
- 4447US2022406620A1Fabricating method for wafer level semiconductor package device and the fabricated semiconductor package devicePANJIT INT INC·Filed 2021·Application pending·0 cites
- 4545US12148675B2Power semiconductor package unit of surface mount technology including a plastic film covering a chipPANJIT INT INC·Filed 2021·Granted Nov 19, 2024·0 cites·14 claims
- 4645US2025140573A1Method of manufacturing pre-molded lead frame for packagingPANJIT INT INC·Filed 2023·Application pending·0 cites
- 4744US2023395553A1Package device preventing solder overflowPANJIT INT INC·Filed 2022·Application pending·0 cites
- 4843US12490519B2Semiconductor device including zener diode ring and manufacturing method of forming the samePANJIT INT INC·Filed 2022·Granted Dec 2, 2025·0 cites·9 claims
- 4943US2022157707A1Thin semiconductor package and manufacturing method thereofPANJIT INT INC·Filed 2020·Application pending·0 cites
- 5043US2023395465A1Semiconductor package with solderable sidewallPANJIT INT INC·Filed 2022·Application pending·0 cites
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