Assignee
PAC TECH & MDASH PACKAGING TECHNOLOGIES GMBH
DE·2 granted patents·1 citations·filing 2004–2009
Top patents by PatentIndex Score
2 records- 0150US7926699B2Method and device for transferring a solder deposit configurationPAC TECH & MDASH PACKAGING TECHNOLOGIES GMBH·Filed 2009·Granted Apr 19, 2011·0 cites·7 claims
- 0240US7932611B2Device for alternately contacting two wafersPAC TECH & MDASH PACKAGING TECHNOLOGIES GMBH·Filed 2004·Granted Apr 26, 2011·1 cites·6 claims
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