Assignee
OYAMADA SEISEI
JP·3 granted patents·1 citations·filing 2008–2011
Top patents by PatentIndex Score
3 records- 0156US8299518B2Semiconductor device and bypass capacitor moduleOYAMADA SEISEI·Filed 2011·Granted Oct 30, 2012·1 cites·5 claims
- 0245US8089005B2Wiring structure of a substrateOYAMADA SEISEI·Filed 2008·Granted Jan 3, 2012·0 cites·7 claims
- 0340US8243245B2BSC macrostructure for three-dimensional wiring and substrate having the BSC macrostructureOYAMADA SEISEI·Filed 2008·Granted Aug 14, 2012·0 cites·8 claims
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