Assignee
OTREMBA RALF
DE·51 granted patents·4 pending applications·273 citations·filing 2005–2012
Top patents by PatentIndex Score
55 records- 0197US8698293B2Multi-chip package and method of manufacturing thereofOTREMBA RALF·Filed 2012·Granted Apr 15, 2014·40 cites·30 claims
- 0295US8975711B2Device including two power semiconductor chips and manufacturing thereofOTREMBA RALF·Filed 2011·Granted Mar 10, 2015·22 cites·26 claims
- 0390US8507320B2Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereofOTREMBA RALF·Filed 2008·Granted Aug 13, 2013·17 cites·10 claims
- 0489US8138587B2Device including two mounting surfacesOTREMBA RALF·Filed 2008·Granted Mar 20, 2012·15 cites·19 claims
- 0587US8513798B2Power semiconductor chip packageOTREMBA RALF·Filed 2010·Granted Aug 20, 2013·7 cites·18 claims
- 0686US8987879B2Semiconductor device including a contact clip having protrusions and manufacturing thereofOTREMBA RALF·Filed 2011·Granted Mar 24, 2015·8 cites·22 claims
- 0786US8227908B2Electronic device having contact elements with a specified cross section and manufacturing thereofOTREMBA RALF·Filed 2008·Granted Jul 24, 2012·11 cites·16 claims
- 0884US8410592B2Semiconductor device and method for producing the sameOTREMBA RALF·Filed 2007·Granted Apr 2, 2013·12 cites·32 claims
- 0982US8410591B2Semiconductor module with multiple semiconductor chipsOTREMBA RALF·Filed 2007·Granted Apr 2, 2013·10 cites·41 claims
- 1082US8188596B2Multi-chip moduleOTREMBA RALF·Filed 2007·Granted May 29, 2012·10 cites·24 claims
- 1181US8975117B2Semiconductor device using diffusion solderingOTREMBA RALF·Filed 2012·Granted Mar 10, 2015·7 cites·15 claims
- 1281US8815647B2Chip package and a method for manufacturing a chip packageOTREMBA RALF·Filed 2012·Granted Aug 26, 2014·6 cites·24 claims
- 1381US8077475B2Electronic deviceOTREMBA RALF·Filed 2007·Granted Dec 13, 2011·8 cites·21 claims
- 1479US8871630B2Manufacturing electronic device having contact elements with a specified cross sectionOTREMBA RALF·Filed 2012·Granted Oct 28, 2014·4 cites·7 claims
- 1579US8691631B2Device including two mounting surfacesOTREMBA RALF·Filed 2012·Granted Apr 8, 2014·4 cites·7 claims
- 1679US8466561B2Semiconductor module with a power semiconductor chip and a passive component and method for producing the sameOTREMBA RALF·Filed 2007·Granted Jun 18, 2013·7 cites·24 claims
- 1779US8410590B2Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layerOTREMBA RALF·Filed 2008·Granted Apr 2, 2013·8 cites·18 claims
- 1877US8637341B2Semiconductor moduleOTREMBA RALF·Filed 2008·Granted Jan 28, 2014·7 cites·16 claims
- 1977US8237268B2Module comprising a semiconductor chipOTREMBA RALF·Filed 2007·Granted Aug 7, 2012·6 cites·29 claims
- 2076US9147637B2Module including a discrete device mounted on a DCB substrateOTREMBA RALF·Filed 2011·Granted Sep 29, 2015·4 cites·12 claims
- 2176US8766430B2Semiconductor modules and methods of formation thereofOTREMBA RALF·Filed 2012·Granted Jul 1, 2014·4 cites·23 claims
- 2276US8334586B2Stacked semiconductor chips with separate encapsulationsOTREMBA RALF·Filed 2011·Granted Dec 18, 2012·4 cites·19 claims
- 2375US8134236B2Electronic module with switching functions and method for producing the sameOTREMBA RALF·Filed 2007·Granted Mar 13, 2012·6 cites·10 claims
- 2474US8253225B2Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereofOTREMBA RALF·Filed 2008·Granted Aug 28, 2012·6 cites·19 claims
- 2574US8115294B2Multichip module with improved system carrierOTREMBA RALF·Filed 2007·Granted Feb 14, 2012·6 cites·18 claims
- 2673US8519545B2Electronic device comprising a chip disposed on a pinOTREMBA RALF·Filed 2010·Granted Aug 27, 2013·3 cites·27 claims
- 2772US8643176B2Power semiconductor chip having two metal layers on one faceOTREMBA RALF·Filed 2011·Granted Feb 4, 2014·3 cites·24 claims
- 2871US8093713B2Module with silicon-based layerOTREMBA RALF·Filed 2007·Granted Jan 10, 2012·4 cites·25 claims
- 2970US8896106B2Semiconductor packages having multiple lead frames and methods of formation thereofOTREMBA RALF·Filed 2012·Granted Nov 25, 2014·2 cites·20 claims
- 3070US8624378B2Chip-housing module and a method for forming a chip-housing moduleOTREMBA RALF·Filed 2011·Granted Jan 7, 2014·2 cites·22 claims
- 3167US8098499B2Circuit arrangement having two semiconductor switching elements and one freewheeling elementOTREMBA RALF·Filed 2008·Granted Jan 17, 2012·3 cites·23 claims
- 3266US8084816B2Semiconductor moduleOTREMBA RALF·Filed 2009·Granted Dec 27, 2011·2 cites·13 claims
- 3363US8860071B2Electro-thermal cooling devices and methods of fabrication thereofOTREMBA RALF·Filed 2012·Granted Oct 14, 2014·1 cites·30 claims
- 3463US8806741B2Method of making an electronic deviceOTREMBA RALF·Filed 2011·Granted Aug 19, 2014·1 cites·5 claims
- 3563US8461645B2Power semiconductor deviceOTREMBA RALF·Filed 2011·Granted Jun 11, 2013·2 cites·23 claims
- 3663US8450861B2Integrated circuit device with semiconductor device components embedded in plastic housing compositionOTREMBA RALF·Filed 2007·Granted May 28, 2013·2 cites·26 claims
- 3763US8124983B2Power transistorOTREMBA RALF·Filed 2008·Granted Feb 28, 2012·2 cites·22 claims
- 3862US9147628B2Package-in-packages and methods of formation thereofOTREMBA RALF·Filed 2012·Granted Sep 29, 2015·1 cites·17 claims
- 3962US8084861B2Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structureOTREMBA RALF·Filed 2006·Granted Dec 27, 2011·2 cites·15 claims
- 4060US8169063B2Semiconductor component and method for producing the sameOTREMBA RALF·Filed 2009·Granted May 1, 2012·1 cites·19 claims
- 4158US8120161B2Semiconductor module including semiconductor chips coupled to external contact elementsOTREMBA RALF·Filed 2007·Granted Feb 21, 2012·2 cites·23 claims
- 4257US8324115B2Semiconductor chip, semiconductor device and methods for producing the sameOTREMBA RALF·Filed 2006·Granted Dec 4, 2012·1 cites·27 claims
- 4352US8633102B2Module comprising a semiconductor chipOTREMBA RALF·Filed 2012·Granted Jan 21, 2014·0 cites·20 claims
- 4452US8324739B2Semiconductor deviceOTREMBA RALF·Filed 2011·Granted Dec 4, 2012·0 cites·25 claims
- 4550US8697497B2Module with silicon-based layerOTREMBA RALF·Filed 2011·Granted Apr 15, 2014·0 cites·9 claims
- 4648US8933555B2Semiconductor chip packageOTREMBA RALF·Filed 2009·Granted Jan 13, 2015·0 cites·7 claims
- 4748US8642408B2Semiconductor deviceOTREMBA RALF·Filed 2010·Granted Feb 4, 2014·0 cites·24 claims
- 4847US8618644B2Electronic device and manufacturing thereofOTREMBA RALF·Filed 2012·Granted Dec 31, 2013·0 cites·15 claims
- 4946US9786584B2Lateral element isolation deviceOTREMBA RALF·Filed 2012·Granted Oct 10, 2017·0 cites·25 claims
- 5045US8970032B2Chip module and method for fabricating a chip moduleOTREMBA RALF·Filed 2011·Granted Mar 3, 2015·0 cites·18 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
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