Assignee
ORTHODYNE ELECTRONICS CORP
US·23 granted patents·3 pending applications·417 citations·filing 1981–2018
Top patents by PatentIndex Score
26 records- 0193US7745253B2Ribbon bonding in an electronic packageORTHODYNE ELECTRONICS CORP·Filed 2007·Granted Jun 29, 2010·27 cites·27 claims
- 0291US9981336B2Ribbon bonding tools, and methods of designing ribbon bonding toolsORTHODYNE ELECTRONICS CORP·Filed 2016·Granted May 29, 2018·7 cites·20 claims
- 0390US9929122B2Ribbon bonding tools and methods of using the sameORTHODYNE ELECTRONICS CORP·Filed 2015·Granted Mar 27, 2018·11 cites·6 claims
- 0490US4976392AUltrasonic wire bonder wire formation and cutter systemORTHODYNE ELECTRONICS CORP·Filed 1989·Granted Dec 11, 1990·104 cites·49 claims
- 0582US7909228B2Ribbon bonding tool and processORTHODYNE ELECTRONICS CORP·Filed 2008·Granted Mar 22, 2011·8 cites·22 claims
- 0679US6439448B1Large wire bonder headORTHODYNE ELECTRONICS CORP·Filed 2000·Granted Aug 27, 2002·59 cites·31 claims
- 0773US5894981AIntegrated pull tester with an ultrasonic wire bonderORTHODYNE ELECTRONICS CORP·Filed 1996·Granted Apr 20, 1999·71 cites·24 claims
- 0870US4824005ADual mode ultrasonic generator in a wire bonding apparatusORTHODYNE ELECTRONICS CORP·Filed 1986·Granted Apr 25, 1989·42 cites·9 claims
- 0968US10092984B2Methods and systems for aligning tooling elements of ultrasonic bonding systemsORTHODYNE ELECTRONICS CORP·Filed 2018·Granted Oct 9, 2018·1 cites·19 claims
- 1068US4438880AUltrasonic wire bond touchdown sensorORTHODYNE ELECTRONICS CORP·Filed 1981·Granted Mar 27, 1984·30 cites·24 claims
- 1167US8746537B2Ultrasonic bonding systems and methods of using the sameORTHODYNE ELECTRONICS CORP·Filed 2013·Granted Jun 10, 2014·2 cites·20 claims
- 1267US6471116B2Wire bonding spool systemORTHODYNE ELECTRONICS CORP·Filed 2001·Granted Oct 29, 2002·15 cites·22 claims
- 1365US7934633B2Ribbon bonding tool and processORTHODYNE ELECTRONICS CORP·Filed 2008·Granted May 3, 2011·2 cites·15 claims
- 1464US9925624B2Methods and systems for aligning tooling elements of ultrasonic bonding systemsORTHODYNE ELECTRONICS CORP·Filed 2016·Granted Mar 27, 2018·1 cites·21 claims
- 1563US8573468B1Ultrasonic bonding systems and methods of using the sameORTHODYNE ELECTRONICS CORP·Filed 2013·Granted Nov 5, 2013·1 cites·68 claims
- 1661US7407079B2Automated filament attachment system for vacuum fluorescent displayORTHODYNE ELECTRONICS CORP·Filed 2003·Granted Aug 5, 2008·13 cites·5 claims
- 1755US9931709B2Wedge bonding tools, wedge bonding systems, and related methodsORTHODYNE ELECTRONICS CORP·Filed 2017·Granted Apr 3, 2018·0 cites·18 claims
- 1855US9527189B2Systems and methods for processing solar substratesORTHODYNE ELECTRONICS CORP·Filed 2014·Granted Dec 27, 2016·0 cites·16 claims
- 1953US8998063B2Wire loop forming systems and methods of using the sameORTHODYNE ELECTRONICS CORP·Filed 2013·Granted Apr 7, 2015·0 cites·17 claims
- 2052US8584922B1Ultrasonic bonding systems and methods of using the sameORTHODYNE ELECTRONICS CORP·Filed 2013·Granted Nov 19, 2013·0 cites·44 claims
- 2147US5868300AArticulated wire bonderORTHODYNE ELECTRONICS CORP·Filed 1996·Granted Feb 9, 1999·20 cites·30 claims
- 2247US2013119111A1Ribbon bonding tools and methods of using the sameORTHODYNE ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 2344US7537149B2Deep access large ribbon bond headORTHODYNE ELECTRONICS CORP·Filed 2006·Granted May 26, 2009·0 cites·11 claims
- 2444US2015144682A1Wire loop forming systems and methods of using the sameORTHODYNE ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 2537US2013019458A1Support system for a semiconductor deviceORTHODYNE ELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 2636US7222737B2Die sorter with reduced mean time to convertORTHODYNE ELECTRONICS CORP·Filed 2003·Granted May 29, 2007·3 cites·19 claims
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