Assignee
OPTIZ INC
US·30 granted patents·2 pending applications·40 citations·filing 2013–2021
Top patents by PatentIndex Score
32 records- 0188US9214592B2Method of making interposer package for CMOS image sensorOPTIZ INC·Filed 2014·Granted Dec 15, 2015·4 cites·10 claims
- 0287US9666730B2Wire bond sensor packageOPTIZ INC·Filed 2015·Granted May 30, 2017·5 cites·16 claims
- 0385US9853079B2Method of forming a stress released image sensor package structureOPTIZ INC·Filed 2016·Granted Dec 26, 2017·4 cites·14 claims
- 0483US9985063B2Imaging device with photo detectors and color filters arranged by color transmission characteristics and absorption coefficientsOPTIZ INC·Filed 2015·Granted May 29, 2018·4 cites·18 claims
- 0581US9996725B2Under screen sensor assemblyOPTIZ INC·Filed 2016·Granted Jun 12, 2018·4 cites·27 claims
- 0680US9543347B2Stress released image sensor package structure and methodOPTIZ INC·Filed 2016·Granted Jan 10, 2017·3 cites·8 claims
- 0778US9496247B2Integrated camera module and method of making sameOPTIZ INC·Filed 2014·Granted Nov 15, 2016·4 cites·34 claims
- 0873US10139619B2Back side illumination image sensor with non-planar optical interfaceOPTIZ INC·Filed 2015·Granted Nov 27, 2018·2 cites·12 claims
- 0973US9524917B2Chip level heat dissipation using siliconOPTIZ INC·Filed 2015·Granted Dec 20, 2016·2 cites·15 claims
- 1071US9893218B2Sensor package with cooling featureOPTIZ INC·Filed 2016·Granted Feb 13, 2018·1 cites·8 claims
- 1168US9893213B2Method of forming a wire bond sensor packageOPTIZ INC·Filed 2017·Granted Feb 13, 2018·1 cites·8 claims
- 1268US9219091B2Low profile sensor module and method of making sameOPTIZ INC·Filed 2014·Granted Dec 22, 2015·2 cites·23 claims
- 1365US9373653B2Stepped package for image sensorOPTIZ INC·Filed 2015·Granted Jun 21, 2016·1 cites·11 claims
- 1464US9570634B2Sensor package with exposed sensor array and method of making sameOPTIZ INC·Filed 2015·Granted Feb 14, 2017·1 cites·16 claims
- 1564US9142695B2Sensor package with exposed sensor array and method of making sameOPTIZ INC·Filed 2014·Granted Sep 22, 2015·1 cites·18 claims
- 1662US9667900B2Three dimensional system-on-chip image sensor packageOPTIZ INC·Filed 2014·Granted May 30, 2017·1 cites·7 claims
- 1761US9190443B2Low profile image sensorOPTIZ INC·Filed 2014·Granted Nov 17, 2015·0 cites·14 claims
- 1858US10199519B2Method of making a sensor package with cooling featureOPTIZ INC·Filed 2018·Granted Feb 5, 2019·0 cites·6 claims
- 1958US9496297B2Sensor package with cooling feature and method of making sameOPTIZ INC·Filed 2014·Granted Nov 15, 2016·0 cites·6 claims
- 2057US9196650B2Method of forming a low profile image sensor packageOPTIZ INC·Filed 2014·Granted Nov 24, 2015·0 cites·4 claims
- 2156US9972730B2Method of making a sensor package with cooling featureOPTIZ INC·Filed 2016·Granted May 15, 2018·0 cites·4 claims
- 2255US9461190B2Low profile sensor package with cooling feature and method of making sameOPTIZ INC·Filed 2014·Granted Oct 4, 2016·0 cites·12 claims
- 2354US8753925B2Method of making 3D integration microelectronic assembly for integrated circuit devicesOPTIZ INC·Filed 2013·Granted Jun 17, 2014·0 cites·10 claims
- 2453US11614361B1Hyperspectral cameraOPTIZ INC·Filed 2021·Granted Mar 28, 2023·0 cites·19 claims
- 2553US8895344B2Method of making a low stress cavity package for back side illuminated image sensorOPTIZ INC·Filed 2013·Granted Nov 25, 2014·0 cites·15 claims
- 2652US11408589B2Monolithic multi-focus light source deviceOPTIZ INC·Filed 2019·Granted Aug 9, 2022·0 cites·19 claims
- 2752US9373660B2Method of forming a low profile image sensor package with an image sensor substrate, a support substrate and a printed circuit boardOPTIZ INC·Filed 2015·Granted Jun 21, 2016·0 cites·10 claims
- 2852US9230947B2Method of forming 3D integrated microelectronic assembly with stress reducing interconnectsOPTIZ INC·Filed 2013·Granted Jan 5, 2016·0 cites·12 claims
- 2952US9054013B2Method of making 3D integration microelectronic assembly for integrated circuit devicesOPTIZ INC·Filed 2013·Granted Jun 9, 2015·0 cites·11 claims
- 3051US9666625B2Method of making low profile sensor package with cooling featureOPTIZ INC·Filed 2016·Granted May 30, 2017·0 cites·8 claims
- 3145US2015189204A1Semiconductor Device On Cover Substrate And Method Of Making SameOPTIZ INC·Filed 2014·Application pending·0 cites
- 3244US2014264693A1Cover-Free Sensor Module And Method Of Making SameOPTIZ INC·Filed 2014·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →