Assignee
OKABE TAKEO
JP·7 granted patents·23 citations·filing 2002–2010
Top patents by PatentIndex Score
7 records- 0192US8246764B2Copper alloy sputtering target and semiconductor element wiringOKABE TAKEO·Filed 2009·Granted Aug 21, 2012·10 cites·14 claims
- 0275US8262816B2Hafnium alloy targetOKABE TAKEO·Filed 2008·Granted Sep 11, 2012·3 cites·2 claims
- 0375US8241438B2Hafnium alloy targetOKABE TAKEO·Filed 2008·Granted Aug 14, 2012·3 cites·2 claims
- 0475US8062440B2Hafnium alloy target and process for producing the sameOKABE TAKEO·Filed 2008·Granted Nov 22, 2011·3 cites·5 claims
- 0558US9472383B2Copper or copper alloy target/copper alloy backing plate assemblyOKABE TAKEO·Filed 2004·Granted Oct 18, 2016·3 cites·10 claims
- 0648US9765425B2Copper alloy sputtering target, process for producing the same and semiconductor element wiringOKABE TAKEO·Filed 2010·Granted Sep 19, 2017·0 cites·20 claims
- 0744US9896745B2Copper alloy sputtering target and method for manufacturing the targetOKABE TAKEO·Filed 2002·Granted Feb 20, 2018·1 cites·14 claims
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