Assignee
OKA YOSHIO
JP·4 granted patents·1 pending application·7 citations·filing 2005–2010
Top patents by PatentIndex Score
5 records- 0170US8866027B2Printed wiring board and method for manufacturing the sameOKA YOSHIO·Filed 2008·Granted Oct 21, 2014·6 cites·15 claims
- 0254US8309853B2Flexible printed wiring boardOKA YOSHIO·Filed 2008·Granted Nov 13, 2012·1 cites·3 claims
- 0349US2012031656A1Substrate for printed wiring board, printed wiring board, and methods for producing sameOKA YOSHIO·Filed 2010·Application pending·0 cites
- 0443US8617688B2Conductive paste and multilayer printed wiring board using the sameOKA YOSHIO·Filed 2006·Granted Dec 31, 2013·0 cites·6 claims
- 0540US8597459B2Conductive paste and method for manufacturing multilayer printed wiring board using the sameOKA YOSHIO·Filed 2005·Granted Dec 3, 2013·0 cites·4 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →