Assignee
OI KIYOSHI
JP·2 granted patents·16 citations·filing 2009–2010
Top patents by PatentIndex Score
2 records- 0189US8669653B2Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductorOI KIYOSHI·Filed 2010·Granted Mar 11, 2014·14 cites·12 claims
- 0260US8138018B2Manufacturing method of semiconductor device having underfill resin formed without void between semiconductor chip and wiring boardOI KIYOSHI·Filed 2009·Granted Mar 20, 2012·2 cites·5 claims
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