Assignee
OHTSUKA SANGYO MAT CO LTD
JP·0 granted patents·2 pending applications·0 citations·filing 2023–2025
Top patents by PatentIndex Score
2 records- 0171US2026062845A1Reinforcement material for foam-molded product, molded product, and method of producing molded productOHTSUKA SANGYO MAT CO LTD·Filed 2025·Application pending·0 cites
- 0266US2024239071A1Molding subsidiary material and method of producing sameOHTSUKA SANGYO MAT CO LTD·Filed 2023·Application pending·0 cites
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