Assignee
OHKUCHI MAT CO LTD
JP·18 granted patents·1 pending application·17 citations·filing 2014–2023
Top patents by PatentIndex Score
19 records- 0193US10847451B2Device for mounting semiconductor element, lead frame, and substrate for mounting semiconductor elementOHKUCHI MAT CO LTD·Filed 2020·Granted Nov 24, 2020·4 cites·7 claims
- 0290US10903150B2Lead frameOHKUCHI MAT CO LTD·Filed 2020·Granted Jan 26, 2021·3 cites·7 claims
- 0390US10777492B1Substrate for mounting semiconductor elementOHKUCHI MAT CO LTD·Filed 2020·Granted Sep 15, 2020·3 cites·4 claims
- 0477US11062983B2Substrate for mounting semiconductor elementOHKUCHI MAT CO LTD·Filed 2020·Granted Jul 13, 2021·1 cites·4 claims
- 0571US10312187B2Multi-row wiring member for semiconductor device and method for manufacturing the sameOHKUCHI MAT CO LTD·Filed 2018·Granted Jun 4, 2019·2 cites·8 claims
- 0667US10622286B2Lead frame and method for manufacturing the sameOHKUCHI MAT CO LTD·Filed 2018·Granted Apr 14, 2020·1 cites·5 claims
- 0759US10304760B2Lead frame and method for manufacturing the sameOHKUCHI MAT CO LTD·Filed 2018·Granted May 28, 2019·2 cites·1 claims
- 0853US11404286B2Lead frameOHKUCHI MAT CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·6 claims
- 0952US2024371733A1Lead frameOHKUCHI MAT CO LTD·Filed 2023·Application pending·0 cites
- 1051US10811346B2Lead frameOHKUCHI MAT CO LTD·Filed 2020·Granted Oct 20, 2020·0 cites·4 claims
- 1151US10763196B1Lead frameOHKUCHI MAT CO LTD·Filed 2020·Granted Sep 1, 2020·0 cites·4 claims
- 1249US10229871B2Lead frameOHKUCHI MAT CO LTD·Filed 2017·Granted Mar 12, 2019·1 cites·4 claims
- 1340US10453782B2Multi-row wiring member for semiconductor device and method for manufacturing the sameOHKUCHI MAT CO LTD·Filed 2018·Granted Oct 22, 2019·0 cites·8 claims
- 1437US10763202B2Multi-row wiring member for semiconductor device and method for manufacturing the sameOHKUCHI MAT CO LTD·Filed 2018·Granted Sep 1, 2020·0 cites·4 claims
- 1537US10276422B2Semiconductor device substrate, semiconductor device wiring member and method for manufacturing them, and method for manufacturing semiconductor device using semiconductor device substrateOHKUCHI MAT CO LTD·Filed 2015·Granted Apr 30, 2019·0 cites·19 claims
- 1634US10886206B2Lead frame, resin-equipped lead frame, optical semiconductor device, and method for manufacturing lead frameOHKUCHI MAT CO LTD·Filed 2019·Granted Jan 5, 2021·0 cites·12 claims
- 1734US10204801B2Method for producing substrate for semiconductor element mountingOHKUCHI MAT CO LTD·Filed 2014·Granted Feb 12, 2019·0 cites·5 claims
- 1831US10727171B2Lead frameOHKUCHI MAT CO LTD·Filed 2017·Granted Jul 28, 2020·0 cites·8 claims
- 1928US10305007B2Multi-row LED wiring member and method for manufacturing the sameOHKUCHI MAT CO LTD·Filed 2017·Granted May 28, 2019·0 cites·6 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →