Assignee
OCTAVO SYSTEMS LLC
US·23 granted patents·6 pending applications·29 citations·filing 2015–2025
Top patents by PatentIndex Score
29 records- 0190US11157676B2Method for routing bond wires in system in a package (SiP) devicesOCTAVO SYSTEMS LLC·Filed 2017·Granted Oct 26, 2021·11 cites·20 claims
- 0288US12001363B2Secure enclave system-in-packageOCTAVO SYSTEMS LLC·Filed 2021·Granted Jun 4, 2024·2 cites·18 claims
- 0384US10204890B2Substrate for system in package (SIP) devicesOCTAVO SYSTEMS LLC·Filed 2015·Granted Feb 12, 2019·4 cites·10 claims
- 0483US10470294B2Reduction of passive components in system-in-package devicesOCTAVO SYSTEMS LLC·Filed 2018·Granted Nov 5, 2019·5 cites·20 claims
- 0582US10714430B2EMI shield for molded packagesOCTAVO SYSTEMS LLC·Filed 2018·Granted Jul 14, 2020·3 cites·10 claims
- 0676US11171126B2Configurable substrate and systemsOCTAVO SYSTEMS LLC·Filed 2016·Granted Nov 9, 2021·3 cites·7 claims
- 0775US12536119B2Secure enclave system-in-packageOCTAVO SYSTEMS LLC·Filed 2024·Granted Jan 27, 2026·0 cites·20 claims
- 0873US12243794B2System in a package modificationsOCTAVO SYSTEMS LLC·Filed 2023·Granted Mar 4, 2025·0 cites·19 claims
- 0973US2025266266A1Molded packages in a molded deviceOCTAVO SYSTEMS LLC·Filed 2025·Application pending·0 cites
- 1067US11171651B2Mixed signal computerOCTAVO SYSTEMS LLC·Filed 2019·Granted Nov 9, 2021·1 cites·18 claims
- 1163US2025218798A1Methods and devices for processing singulated substratesOCTAVO SYSTEMS LLC·Filed 2024·Application pending·0 cites
- 1260US11869823B2System in a package modificationsOCTAVO SYSTEMS LLC·Filed 2020·Granted Jan 9, 2024·0 cites·13 claims
- 1360US11302648B2EMI shield for molded packagesOCTAVO SYSTEMS LLC·Filed 2020·Granted Apr 12, 2022·0 cites·17 claims
- 1459US12535839B2Component communications in system-in-package systemsOCTAVO SYSTEMS LLC·Filed 2022·Granted Jan 27, 2026·0 cites·6 claims
- 1558US10867979B2Circuit mounting structure and lead frame for system in package (SIP) devicesOCTAVO SYSTEMS LLC·Filed 2018·Granted Dec 15, 2020·0 cites·15 claims
- 1656US2022028704A1Molded packages in a molded deviceOCTAVO SYSTEMS LLC·Filed 2019·Application pending·0 cites
- 1755US2025216440A1Reliability testing using functional devicesOCTAVO SYSTEMS LLC·Filed 2023·Application pending·0 cites
- 1851US2024266243A1System in a package (sip) thermal managementOCTAVO SYSTEMS LLC·Filed 2022·Application pending·0 cites
- 1949US11308290B2Mixed signal computer architectureOCTAVO SYSTEMS LLC·Filed 2018·Granted Apr 19, 2022·0 cites·17 claims
- 2049US11257803B2System in a package connectorsOCTAVO SYSTEMS LLC·Filed 2019·Granted Feb 22, 2022·0 cites·18 claims
- 2145US11347478B2Analog arithmetic unitOCTAVO SYSTEMS LLC·Filed 2019·Granted May 31, 2022·0 cites·18 claims
- 2245US11309056B2Automatic test equipment method for testing system in a package devicesOCTAVO SYSTEMS LLC·Filed 2018·Granted Apr 19, 2022·0 cites·20 claims
- 2345US11211369B2Service module for SIP devicesOCTAVO SYSTEMS LLC·Filed 2019·Granted Dec 28, 2021·0 cites·9 claims
- 2441US11610844B2High performance module for SiPOCTAVO SYSTEMS LLC·Filed 2018·Granted Mar 21, 2023·0 cites·16 claims
- 2540US11502030B2System and method of assembling a systemOCTAVO SYSTEMS LLC·Filed 2017·Granted Nov 15, 2022·0 cites·14 claims
- 2640US11373720B2Analog memory cells with valid flagOCTAVO SYSTEMS LLC·Filed 2019·Granted Jun 28, 2022·0 cites·13 claims
- 2738US11032910B2System-in-Package device ball map and layout optimizationOCTAVO SYSTEMS LLC·Filed 2018·Granted Jun 8, 2021·0 cites·21 claims
- 2838US2017221871A1Systems and methods for manufacturing electronic devicesOCTAVO SYSTEMS LLC·Filed 2017·Application pending·0 cites
- 2936US11416050B2Component communications in system-in-package systemsOCTAVO SYSTEMS LLC·Filed 2017·Granted Aug 16, 2022·0 cites·23 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →