Assignee
NISHIMURA TETSURO
JP·7 granted patents·2 pending applications·7 citations·filing 2006–2012
Top patents by PatentIndex Score
9 records- 0175US8557021B2Method of regulating nickel concentration in lead-free solder containing nickelNISHIMURA TETSURO·Filed 2008·Granted Oct 15, 2013·2 cites·5 claims
- 0268US8999519B2Solder jointNISHIMURA TETSURO·Filed 2008·Granted Apr 7, 2015·3 cites·19 claims
- 0366US9999945B2Solder alloyNISHIMURA TETSURO·Filed 2012·Granted Jun 19, 2018·1 cites·7 claims
- 0466US9339893B2Lead-free solder alloyNISHIMURA TETSURO·Filed 2012·Granted May 17, 2016·1 cites·3 claims
- 0557US8163061B2Method of copper precipitation in lead-free solder, granulation and separation of (CuX)6Sn5 compounds and recovery of tinNISHIMURA TETSURO·Filed 2009·Granted Apr 24, 2012·0 cites·6 claims
- 0655US2012286026A1Wire solder, method of feeding the same and apparatus thereforNISHIMURA TETSURO·Filed 2012·Application pending·0 cites
- 0755US2012280020A1Wire solder, method of feeding the same and apparatus thereforNISHIMURA TETSURO·Filed 2012·Application pending·0 cites
- 0850US8652269B2Flux composition and soldering paste compositionNISHIMURA TETSURO·Filed 2009·Granted Feb 18, 2014·0 cites·33 claims
- 0947US8147746B2Apparatus for precipitation/separation of excess copper in lead-free solderNISHIMURA TETSURO·Filed 2006·Granted Apr 3, 2012·0 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when NISHIMURA TETSURO files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →