Assignee
NISHIMURA TAKAO
JP·13 granted patents·55 citations·filing 2006–2012
Top patents by PatentIndex Score
13 records- 0188US8748229B2Manufacturing method including deformation of supporting board to accommodate semiconductor deviceNISHIMURA TAKAO·Filed 2012·Granted Jun 10, 2014·8 cites·11 claims
- 0281US8841776B2Stacked semiconductor chips having double adhesive insulating layer interposed therebetweenNISHIMURA TAKAO·Filed 2008·Granted Sep 23, 2014·11 cites·12 claims
- 0381US8198728B2Semiconductor device and plural semiconductor elements with suppressed bendingNISHIMURA TAKAO·Filed 2008·Granted Jun 12, 2012·9 cites·7 claims
- 0478US8810043B2Semiconductor deviceNISHIMURA TAKAO·Filed 2011·Granted Aug 19, 2014·4 cites·9 claims
- 0578US8134240B2Semiconductor device and manufacturing method for the sameNISHIMURA TAKAO·Filed 2009·Granted Mar 13, 2012·7 cites·3 claims
- 0676US8076785B2Semiconductor deviceNISHIMURA TAKAO·Filed 2006·Granted Dec 13, 2011·6 cites·1 claims
- 0770US9076559B2Method of operating nuclear plantNISHIMURA TAKAO·Filed 2009·Granted Jul 7, 2015·2 cites·2 claims
- 0869US8404980B2Relay board and semiconductor device having the relay boardNISHIMURA TAKAO·Filed 2010·Granted Mar 26, 2013·2 cites·17 claims
- 0969US8125789B2Wiring substrate and electronic deviceNISHIMURA TAKAO·Filed 2008·Granted Feb 28, 2012·3 cites·15 claims
- 1061US8076769B2Semiconductor device and manufacturing method of semiconductor deviceNISHIMURA TAKAO·Filed 2008·Granted Dec 13, 2011·1 cites·15 claims
- 1157US8659168B2Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring boardNISHIMURA TAKAO·Filed 2008·Granted Feb 25, 2014·1 cites·14 claims
- 1255US8230590B2Method for mounting electronic componentsNISHIMURA TAKAO·Filed 2008·Granted Jul 31, 2012·1 cites·12 claims
- 1343US9134433B2Nuclear reactor fuel integrity monitorNISHIMURA TAKAO·Filed 2011·Granted Sep 15, 2015·0 cites·3 claims
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