Assignee
NIKKO MATERIALS CO LTD
JP·52 granted patents·6 pending applications·853 citations·filing 1999–2010
Top patents by PatentIndex Score
58 records- 0193US6755948B1Titanium target for sputteringNIKKO MATERIALS CO LTD·Filed 2000·Granted Jun 29, 2004·34 cites·4 claims
- 0292US6710181B2Imidazole/organic monocarboxylic acid salt derivative reaction product, method for producing the same, and surface treatment agent, resin additive and resin composition using the sameNIKKO MATERIALS CO LTD·Filed 2001·Granted Mar 23, 2004·37 cites·3 claims
- 0391US6896788B2Method of producing a higher-purity metalNIKKO MATERIALS CO LTD·Filed 2001·Granted May 24, 2005·47 cites·22 claims
- 0490US6858116B2Sputtering target producing few particles, backing plate or sputtering apparatus and sputtering method producing few particlesNIKKO MATERIALS CO LTD·Filed 2001·Granted Feb 22, 2005·41 cites·19 claims
- 0590US6835241B2Surface treatment for copper foilNIKKO MATERIALS CO LTD·Filed 2002·Granted Dec 28, 2004·37 cites·4 claims
- 0689US6759143B2Tantalum or tungsten target-copper alloy backing plate assembly and production method thereforNIKKO MATERIALS CO LTD·Filed 2001·Granted Jul 6, 2004·39 cites·2 claims
- 0789US6638642B2Copper foil excellent in laser beam drilling performance and production method thereforNIKKO MATERIALS CO LTD·Filed 2000·Granted Oct 28, 2003·44 cites·21 claims
- 0886US6793124B1Diffusion-joined target assemly of high-purity cobalt target and copper alloy backing plate and production method thereforNIKKO MATERIALS CO LTD·Filed 2001·Granted Sep 21, 2004·30 cites·2 claims
- 0985US6833198B2Copper clad laminateNIKKO MATERIALS CO LTD·Filed 2001·Granted Dec 21, 2004·32 cites·4 claims
- 1085US6582535B1Tungsten target for sputtering and method for preparing thereofNIKKO MATERIALS CO LTD·Filed 2000·Granted Jun 24, 2003·34 cites·1 claims
- 1184US6780467B2Plating pretreatment agent and metal plating method using the sameNIKKO MATERIALS CO LTD·Filed 2001·Granted Aug 24, 2004·24 cites·14 claims
- 1283US7432335B2Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the sameNIKKO MATERIALS CO LTD·Filed 2006·Granted Oct 7, 2008·4 cites·2 claims
- 1383US6723183B2Silicide target for depositing less embrittling gate oxide and method of manufacturing silicide targetNIKKO MATERIALS CO LTD·Filed 2001·Granted Apr 20, 2004·32 cites·16 claims
- 1482US7005055B2Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the sameNIKKO MATERIALS CO LTD·Filed 2003·Granted Feb 28, 2006·11 cites·4 claims
- 1582US6843975B1Oxide sintered body and manufacturing method thereofNIKKO MATERIALS CO LTD·Filed 2001·Granted Jan 18, 2005·19 cites·4 claims
- 1681US7651783B2Surface treated copper filmNIKKO MATERIALS CO LTD·Filed 2002·Granted Jan 26, 2010·25 cites·5 claims
- 1781US6528442B1Optical transparent film and sputtering target for forming optical transparent filmNIKKO MATERIALS CO LTD·Filed 1999·Granted Mar 4, 2003·65 cites·7 claims
- 1880US6497854B2Cathode material for a lithium secondary battery and method for manufacturing sameNIKKO MATERIALS CO LTD·Filed 2001·Granted Dec 24, 2002·21 cites·6 claims
- 1977US7678257B2Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the sameNIKKO MATERIALS CO LTD·Filed 2007·Granted Mar 16, 2010·1 cites·1 claims
- 2077US7288242B2Lithium-containing complex oxide and method of producing sameNIKKO MATERIALS CO LTD·Filed 2003·Granted Oct 30, 2007·11 cites·6 claims
- 2177US6986834B2Hafnium silicide target and manufacturing method for preparation thereofNIKKO MATERIALS CO LTD·Filed 2003·Granted Jan 17, 2006·22 cites·9 claims
- 2277US6960391B2Carrier-attached copper foil and printed board using the copper foilNIKKO MATERIALS CO LTD·Filed 2002·Granted Nov 1, 2005·25 cites·14 claims
- 2377US6562222B1Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplatingNIKKO MATERIALS CO LTD·Filed 2000·Granted May 13, 2003·35 cites·17 claims
- 2476US6861030B2Method of manufacturing high purity zirconium and hafniumNIKKO MATERIALS CO LTD·Filed 2001·Granted Mar 1, 2005·23 cites·20 claims
- 2576US6132487AMixed powder for powder metallurgy, sintered compact of powder metallurgy, and methods for the manufacturing thereofNIKKO MATERIALS CO LTD·Filed 1999·Granted Oct 17, 2000·24 cites·12 claims
- 2672US6875325B2Sputtering target producing few particlesNIKKO MATERIALS CO LTD·Filed 2001·Granted Apr 5, 2005·11 cites·11 claims
- 2771US7390354B2Electroless gold plating solutionNIKKO MATERIALS CO LTD·Filed 2005·Granted Jun 24, 2008·1 cites·3 claims
- 2871US6916865B2Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resinsNIKKO MATERIALS CO LTD·Filed 2002·Granted Jul 12, 2005·6 cites·6 claims
- 2971US6464847B1Sputtering targetNIKKO MATERIALS CO LTD·Filed 2000·Granted Oct 15, 2002·16 cites·14 claims
- 3069US7179741B2Electroless plating method and semiconductor wafer on which metal plating layer is formedNIKKO MATERIALS CO LTD·Filed 2003·Granted Feb 20, 2007·9 cites·16 claims
- 3169US7094845B2Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the sameNIKKO MATERIALS CO LTD·Filed 2002·Granted Aug 22, 2006·7 cites·3 claims
- 3269US6929772B2Manufacturing method of ito powder with tin dissolved in indium oxide, and manufacturing method of ito targetNIKKO MATERIALS CO LTD·Filed 2001·Granted Aug 16, 2005·12 cites·18 claims
- 3368US7777078B2Copper electrolytic solution and electrolytic copper foil produced therewithNIKKO MATERIALS CO LTD·Filed 2003·Granted Aug 17, 2010·4 cites·2 claims
- 3467US6284111B1Sputtering target free of surface-deformed layersNIKKO MATERIALS CO LTD·Filed 1999·Granted Sep 4, 2001·16 cites·1 claims
- 3563US6562134B1Crystal growing device and method of manufacturing single crystalNIKKO MATERIALS CO LTD·Filed 2000·Granted May 13, 2003·6 cites·20 claims
- 3661US7378160B2Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the sameNIKKO MATERIALS CO LTD·Filed 2005·Granted May 27, 2008·1 cites·4 claims
- 3757US7002230B2CdTe-base compound semiconductor single crystal for electro-optic elementNIKKO MATERIALS CO LTD·Filed 2004·Granted Feb 21, 2006·6 cites·4 claims
- 3856US7144491B2Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewithNIKKO MATERIALS CO LTD·Filed 2003·Granted Dec 5, 2006·5 cites·2 claims
- 3956US2010270163A1Copper electrolytic solution and electrolytic copper foil produced therewithNIKKO MATERIALS CO LTD·Filed 2010·Application pending·0 cites
- 4055US6900522B2Chamfered semiconductor wafer and method of manufacturing the sameNIKKO MATERIALS CO LTD·Filed 2002·Granted May 31, 2005·5 cites·8 claims
- 4155US6809138B2Adhesion accelerator for bonding rubber to metal and rubber compositionNIKKO MATERIALS CO LTD·Filed 2002·Granted Oct 26, 2004·1 cites·21 claims
- 4254US6605356B2Metal surface treatment agent, and metal material coated with sameNIKKO MATERIALS CO LTD·Filed 2001·Granted Aug 12, 2003·5 cites·6 claims
- 4353US6921577B2Water-based metal surface treatment agentNIKKO MATERIALS CO LTD·Filed 2002·Granted Jul 26, 2005·1 cites·8 claims
- 4452US7045871B2II-VI compound semiconductor crystal and photoelectric conversion deviceNIKKO MATERIALS CO LTD·Filed 2005·Granted May 16, 2006·0 cites·2 claims
- 4552US6875272B2Method for preparing GaN based compound semiconductor crystalNIKKO MATERIALS CO LTD·Filed 2002·Granted Apr 5, 2005·4 cites·4 claims
- 4651US7419536B2Electroless gold plating liquidNIKKO MATERIALS CO LTD·Filed 2004·Granted Sep 2, 2008·1 cites·5 claims
- 4750US7300501B2Electroless gold plating liquidNIKKO MATERIALS CO LTD·Filed 2005·Granted Nov 27, 2007·0 cites·4 claims
- 4850US6933519B2II-VI compound semiconductor crystalNIKKO MATERIALS CO LTD·Filed 2002·Granted Aug 23, 2005·3 cites·4 claims
- 4949US6745092B2Product management system, and host computer and recorded medium used in the systemNIKKO MATERIALS CO LTD·Filed 2001·Granted Jun 1, 2004·0 cites·11 claims
- 5048US6319621B1Copper foil having glossy surface with excellent oxidation resistance and method of manufacturing the sameNIKKO MATERIALS CO LTD·Filed 1999·Granted Nov 20, 2001·11 cites·5 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
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