Assignee
NIHON SUPERIOR CO LTD
JP·9 granted patents·5 pending applications·10 citations·filing 1994–2021
Top patents by PatentIndex Score
14 records- 0184US11839937B2Lead-free solder alloy and solder joint partNIHON SUPERIOR CO LTD·Filed 2020·Granted Dec 12, 2023·1 cites·12 claims
- 0270US12521822B2Sn solder paste comprising cu-co metal particlesNIHON SUPERIOR CO LTD·Filed 2020·Granted Jan 13, 2026·0 cites·7 claims
- 0369US12172242B2Lead-free solder alloyNIHON SUPERIOR CO LTD·Filed 2019·Granted Dec 24, 2024·0 cites·12 claims
- 0468US12377501B2Solder preform containing Cu—Co particlesNIHON SUPERIOR CO LTD·Filed 2020·Granted Aug 5, 2025·0 cites·3 claims
- 0562US2024238915A1Lead-free solder pasteNIHON SUPERIOR CO LTD·Filed 2021·Application pending·0 cites
- 0660US2014224861A1Wire solder, method of feeding the same, and apparatus and system thereforNIHON SUPERIOR CO LTD·Filed 2014·Application pending·0 cites
- 0757US10286497B2Lead-free solder alloyNIHON SUPERIOR CO LTD·Filed 2015·Granted May 14, 2019·0 cites·6 claims
- 0853US11980974B2Solder joint part and method for manufacturing the sameNIHON SUPERIOR CO LTD·Filed 2019·Granted May 14, 2024·0 cites·8 claims
- 0952US9999936B2Solder wire bobbinless coilNIHON SUPERIOR CO LTD·Filed 2016·Granted Jun 19, 2018·0 cites·6 claims
- 1050US5487868ATin based solder alloy containing lead, antimony, and telluriumNIHON SUPERIOR CO LTD·Filed 1994·Granted Jan 30, 1996·9 cites·2 claims
- 1147US2011272454A1Wire solder, method of feeding the same and apparatus thereforNIHON SUPERIOR CO LTD·Filed 2010·Application pending·0 cites
- 1246US10329642B2Solder alloy and joint thereofNIHON SUPERIOR CO LTD·Filed 2014·Granted Jun 25, 2019·0 cites·3 claims
- 1340US2022281035A1Solder-metal mesh composite material and method for producing sameNIHON SUPERIOR CO LTD·Filed 2020·Application pending·0 cites
- 1438US2020140975A1Soldered JointNIHON SUPERIOR CO LTD·Filed 2018·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →