Assignee
NI CHING-YU
TW·2 granted patents·1 pending application·0 citations·filing 2010–2011
Top patents by PatentIndex Score
3 records- 0144US8564123B2Chip package and fabrication method thereofNI CHING-YU·Filed 2011·Granted Oct 22, 2013·0 cites·15 claims
- 0243US2011127681A1Chip package and fabrication method thereofNI CHING-YU·Filed 2010·Application pending·0 cites
- 0333US8766400B2Electronic device containing passive components and fabrication method thereofNI CHING-YU·Filed 2010·Granted Jul 1, 2014·0 cites·22 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →