Assignee
NGK ELECTRONICS DEVICES INC
JP·9 granted patents·6 pending applications·6 citations·filing 2017–2024
Top patents by PatentIndex Score
15 records- 0188US10790245B2High-frequency ceramic board and high-frequency semiconductor element packageNGK ELECTRONICS DEVICES INC·Filed 2018·Granted Sep 29, 2020·6 cites·10 claims
- 0261US2025100925A1Sintered bodyNGK ELECTRONICS DEVICES INC·Filed 2024·Application pending·0 cites
- 0359US2025024592A1Ceramic wiring memberNGK ELECTRONICS DEVICES INC·Filed 2024·Application pending·0 cites
- 0459US2025024599A1Ceramic wiring memberNGK ELECTRONICS DEVICES INC·Filed 2024·Application pending·0 cites
- 0557US12209313B2Metal member and production method thereforNGK ELECTRONICS DEVICES INC·Filed 2021·Granted Jan 28, 2025·0 cites·14 claims
- 0654US2024107678A1Method of manufacturing bonded substrate, method of manufacturing circuit substrate, and circuit substrateNGK ELECTRONICS DEVICES INC·Filed 2023·Application pending·0 cites
- 0753US2023335568A1PackageNGK ELECTRONICS DEVICES INC·Filed 2023·Application pending·0 cites
- 0851US11854934B2Package with heat dissipating substrateNGK ELECTRONICS DEVICES INC·Filed 2022·Granted Dec 26, 2023·0 cites·5 claims
- 0946US11929301B2Package and electronic deviceNGK ELECTRONICS DEVICES INC·Filed 2022·Granted Mar 12, 2024·0 cites·8 claims
- 1045US11978682B2Package, and method for manufacturing power semiconductor moduleNGK ELECTRONICS DEVICES INC·Filed 2021·Granted May 7, 2024·0 cites·8 claims
- 1145US11901268B2Package with an electrode-attached frame supported by a heat sink, and method for manufacturing power semiconductor module provided therewithNGK ELECTRONICS DEVICES INC·Filed 2021·Granted Feb 13, 2024·0 cites·11 claims
- 1245US11178762B2Connection structure for wiring substrate and flexible substrate and package for housing electronic componentsNGK ELECTRONICS DEVICES INC·Filed 2020·Granted Nov 16, 2021·0 cites·8 claims
- 1345US2022020651A1Power semiconductor module and manufacturing method for power semiconductor moduleNGK ELECTRONICS DEVICES INC·Filed 2021·Application pending·0 cites
- 1444US11849538B2Composite wiring board, package, and electronic deviceNGK ELECTRONICS DEVICES INC·Filed 2021·Granted Dec 19, 2023·0 cites·10 claims
- 1524US10937715B2Substrate for power module, collective substrate for power modules, and method for manufacturing substrate for power moduleNGK ELECTRONICS DEVICES INC·Filed 2017·Granted Mar 2, 2021·0 cites·4 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →