Individual holder
NEVIN WILLIAM A
0 granted patents·2 pending applications·0 citations·filing 2005–2007
Individually held — no corporate assignee on record.
Technology mixH10P2
Top patents by PatentIndex Score
2 records- 0149US2008026230A1Method for bonding a pair of silicon wafers together, and a semiconductor waferNEVIN WILLIAM A·Filed 2007·Application pending·0 cites
- 0245US2006030123A1Method for bonding a pair of silicon wafers together, and a semiconductor waferNEVIN WILLIAM A·Filed 2005·Application pending·0 cites
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