Assignee
NEPES CORP
KR·5 granted patents·4 pending applications·94 citations·filing 2006–2008
Top patents by PatentIndex Score
9 records- 0192US7977789B2Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the sameNEPES CORP·Filed 2006·Granted Jul 12, 2011·64 cites·19 claims
- 0283US7808095B2Ultra slim semiconductor package and method of fabricating the sameNEPES CORP·Filed 2008·Granted Oct 5, 2010·17 cites·10 claims
- 0368US7919833B2Semiconductor package having a crack-propagation preventing unitNEPES CORP·Filed 2008·Granted Apr 5, 2011·5 cites·7 claims
- 0465US7952210B2Semiconductor package and fabrication method thereofNEPES CORP·Filed 2008·Granted May 31, 2011·4 cites·16 claims
- 0564US7906842B2Wafer level system in package and fabrication method thereofNEPES CORP·Filed 2007·Granted Mar 15, 2011·4 cites·15 claims
- 0656US2009032942A1Semiconductor chip with solder bump and method of fabricating the sameNEPES CORP·Filed 2006·Application pending·0 cites
- 0745US2009020871A1Semiconductor chip with solder bump suppressing growth of inter-metallic compound and method of fabricating the sameNEPES CORP·Filed 2006·Application pending·0 cites
- 0842US2010032831A1Bump structure foe semiconductor deviceNEPES CORP·Filed 2008·Application pending·0 cites
- 0941US2009146281A1System in package and fabrication method thereofNEPES CORP·Filed 2008·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →