Assignee
NEC ELECTRONICS COROPORATION
JP·0 granted patents·2 pending applications·0 citations·filing 2007–2008
Top patents by PatentIndex Score
2 records- 0148US2009115022A1Semiconductor deviceNEC ELECTRONICS COROPORATION·Filed 2008·Application pending·0 cites
- 0242US2007194457A1Semiconductor package featuring thin semiconductor substrate and liquid crystal polymer sheet, and method for manufacturing such semiconductor packageNEC ELECTRONICS COROPORATION·Filed 2007·Application pending·0 cites
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