Assignee
ND HI TECH LAB INC
TW·5 granted patents·29 pending applications·0 citations·filing 2022–2025
Top patents by PatentIndex Score
34 records- 0183US2026033394A1High bandwidth memory stack with side edge interconnection and 3d ic structure with the sameND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 0281US2026076267A13d integrated circuit packageND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 0380US2025385203A1Semiconductor package and semiconductor package assembly with edge side interconnection and method of forming the sameND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 0474US2025174539A13d integrated circuit package and substrate structure thereofND HI TECH LAB INC·Filed 2024·Application pending·0 cites
- 0573US12593688B2Manufacturing method of diamond composite waferND HI TECH LAB INC·Filed 2022·Granted Mar 31, 2026·0 cites·25 claims
- 0672US2024047298A1Semiconductor structureND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 0772US2024047192A1Manufacturing method of diamond composite waferND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 0870US12442835B2Probe card system, method of manufacturing probe card system, method of using probe card systemND HI TECH LAB INC·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 0969US2024128146A1Semiconductor package for enhanced coolingND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 1069US2024128208A1Semiconductor package and semiconductor package assembly with edge side interconnection and method of forming the sameND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 1169US2024128150A1Semiconductor package structure for enhanced coolingND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 1267US12469836B2High bandwidth memory stack with side edge interconnection and 3D IC structure with the sameND HI TECH LAB INC·Filed 2025·Granted Nov 11, 2025·0 cites·18 claims
- 1365US2026068186A1High-bandwidth memory stack with side edge interconnection and liquid cooling structureND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 1464US2026090421A1Composite substrate, semiconductor device using the same and manufacturing method thereofND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 1562US2026060112A1Panel-level semiconductor package structure and method for manufacturing thereofND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 1661US2024421027A1Semiconductor package structure for enhanced coolingND HI TECH LAB INC·Filed 2024·Application pending·0 cites
- 1761US2025038067A1Semiconductor deviceND HI TECH LAB INC·Filed 2024·Application pending·0 cites
- 1859US2024379498A1Semiconductor package for liquid immersion cooling and method of forming the sameND HI TECH LAB INC·Filed 2024·Application pending·0 cites
- 1959US2024379636A1Semiconductor device package and method of manufacturing the sameND HI TECH LAB INC·Filed 2024·Application pending·0 cites
- 2057US12564049B2Diamond enhanced advanced ICs and advanced IC packagesND HI TECH LAB INC·Filed 2022·Granted Feb 24, 2026·0 cites·16 claims
- 2157US2024234354A1Semiconductor package and method for manufacturing the sameND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 2256US2024006301A1Semiconductor packageND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 2355US2023387032A1Semiconductor device and manufacturing method thereofND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 2455US2025287614A1Cowos ic structure with edge-pad semiconductor dieND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 2554US2025349745A1Semiconductor device and manufacturing method thereofND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 2654US2023268288A1Semiconductor device and manufacturing method thereofND HI TECH LAB INC·Filed 2023·Application pending·0 cites
- 2754US2024047343A1Semiconductor device, semiconductor substrate and manufacturing method thereofND HI TECH LAB INC·Filed 2022·Application pending·0 cites
- 2853US2023317693A1Die package, ic package and manufacturing process thereofND HI TECH LAB INC·Filed 2022·Application pending·0 cites
- 2951US2023317443A1Composite semiconductor wafer/chip for advanced ics and advanced ic packages and the manufacture method thereofND HI TECH LAB INC·Filed 2022·Application pending·0 cites
- 3050US12471296B2High bandwidth memory stack with side edge interconnection and 3D IC structure with the sameND HI TECH LAB INC·Filed 2025·Granted Nov 11, 2025·0 cites·20 claims
- 3150US2023238345A1High-yielding and ultrafine pitch packages for large-scale ic or advanced icND HI TECH LAB INC·Filed 2022·Application pending·0 cites
- 3249US2025233042A1Semiconductor package and semiconductor package assembly with edge interconnection and method of forming the sameND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 3349US2025233045A1Semiconductor package and semiconductor package assembly with edge interconnection and method of forming the sameND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 3448US2025253275A1Semiconductor device and manufacturing method thereofND HI TECH LAB INC·Filed 2025·Application pending·0 cites
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