Assignee
NANONEXUS INC
US·18 granted patents·1,219 citations·filing 2000–2008
Top patents by PatentIndex Score
18 records- 0199US6812718B1Massively parallel interface for electronic circuitsNANONEXUS INC·Filed 2000·Granted Nov 2, 2004·175 cites·91 claims
- 0298US7621761B2Systems for testing and packaging integrated circuitsNANONEXUS INC·Filed 2007·Granted Nov 24, 2009·83 cites·18 claims
- 0397US6917525B2Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springsNANONEXUS INC·Filed 2002·Granted Jul 12, 2005·180 cites·67 claims
- 0497US6815961B2Construction structures and manufacturing processes for integrated circuit wafer probe card assembliesNANONEXUS INC·Filed 2002·Granted Nov 9, 2004·113 cites·10 claims
- 0597US6791171B2Systems for testing and packaging integrated circuitsNANONEXUS INC·Filed 2001·Granted Sep 14, 2004·125 cites·109 claims
- 0696US7579848B2High density interconnect system for IC packages and interconnect assembliesNANONEXUS INC·Filed 2006·Granted Aug 25, 2009·72 cites·50 claims
- 0796US7009412B2Massively parallel interface for electronic circuitNANONEXUS INC·Filed 2004·Granted Mar 7, 2006·62 cites·6 claims
- 0896US6799976B1Construction structures and manufacturing processes for integrated circuit wafer probe card assembliesNANONEXUS INC·Filed 2000·Granted Oct 5, 2004·92 cites·4 claims
- 0995US7349223B2Enhanced compliant probe card systems having improved planarityNANONEXUS INC·Filed 2004·Granted Mar 25, 2008·110 cites·46 claims
- 1095US7247035B2Enhanced stress metal spring contactorNANONEXUS INC·Filed 2004·Granted Jul 24, 2007·61 cites·22 claims
- 1193US7382142B2High density interconnect system having rapid fabrication cycleNANONEXUS INC·Filed 2005·Granted Jun 3, 2008·43 cites·29 claims
- 1290US7138818B2Massively parallel interface for electronic circuitNANONEXUS INC·Filed 2006·Granted Nov 21, 2006·13 cites·25 claims
- 1386US7126220B2Miniaturized contact springNANONEXUS INC·Filed 2003·Granted Oct 24, 2006·40 cites·25 claims
- 1478US7153399B2Method and apparatus for producing uniform isotropic stresses in a sputtered filmNANONEXUS INC·Filed 2002·Granted Dec 26, 2006·14 cites·18 claims
- 1574US7126358B2Construction structures and manufacturing processes for integrated circuit wafer probe card assembliesNANONEXUS INC·Filed 2004·Granted Oct 24, 2006·13 cites·47 claims
- 1670US7137830B2Miniaturized contact springNANONEXUS INC·Filed 2003·Granted Nov 21, 2006·14 cites·30 claims
- 1757US7772860B2Massively parallel interface for electronic circuitNANONEXUS INC·Filed 2008·Granted Aug 10, 2010·1 cites·16 claims
- 1857US6710609B2Mosaic decal probeNANONEXUS INC·Filed 2002·Granted Mar 23, 2004·8 cites·10 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →