Assignee
NAMICS CORP
JP·71 granted patents·42 pending applications·115 citations·filing 1996–2023
Top patents by PatentIndex Score
113 records- 0191US11773301B2Resin compositionNAMICS CORP·Filed 2019·Granted Oct 3, 2023·2 cites·12 claims
- 0289US10472461B2Semiconductor device and image sensor moduleNAMICS CORP·Filed 2016·Granted Nov 12, 2019·2 cites·15 claims
- 0387US10141090B2Resin composition, paste for forming a varistor element, and varistor elementNAMICS CORP·Filed 2018·Granted Nov 27, 2018·3 cites·11 claims
- 0485US11230617B2Resin compositionNAMICS CORP·Filed 2018·Granted Jan 25, 2022·4 cites·16 claims
- 0585US10246550B2Resin compositionNAMICS CORP·Filed 2016·Granted Apr 2, 2019·2 cites·16 claims
- 0684US6498200B1Cationically polymerizable resin compositionNAMICS CORP·Filed 2000·Granted Dec 24, 2002·31 cites·15 claims
- 0782US9795040B2Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boardsNAMICS CORP·Filed 2016·Granted Oct 17, 2017·3 cites·21 claims
- 0878US10023775B2Film adhesive and semiconductor device including the sameNAMICS CORP·Filed 2016·Granted Jul 17, 2018·4 cites·17 claims
- 0978US9263727B2All solid state secondary batteryNAMICS CORP·Filed 2014·Granted Feb 16, 2016·2 cites·16 claims
- 1077US9926405B2Resin compositionNAMICS CORP·Filed 2015·Granted Mar 27, 2018·1 cites·20 claims
- 1177US9805998B2Liquid sealing material and electronic component using sameNAMICS CORP·Filed 2013·Granted Oct 31, 2017·4 cites·18 claims
- 1275US10276277B2Resin composition, copper paste, and semiconductor deviceNAMICS CORP·Filed 2016·Granted Apr 30, 2019·2 cites·20 claims
- 1373US9457512B2Lithium ion rechargeable battery and process for producing the lithium ion rechargeable batteryNAMICS CORP·Filed 2013·Granted Oct 4, 2016·1 cites·10 claims
- 1472US9789546B2Method for producing a metal particleNAMICS CORP·Filed 2015·Granted Oct 17, 2017·1 cites·5 claims
- 1571US11623813B2Resin composition-filled syringe, and production method and preservation method for sameNAMICS CORP·Filed 2020·Granted Apr 11, 2023·1 cites·12 claims
- 1671US11339269B2Resin composition for forming varistor and varistorNAMICS CORP·Filed 2018·Granted May 24, 2022·1 cites·9 claims
- 1770US11935673B2Varistor forming paste, cured product thereof, and varistorNAMICS CORP·Filed 2020·Granted Mar 19, 2024·0 cites·13 claims
- 1870US10290601B2Method of manufacturing bonded bodyNAMICS CORP·Filed 2016·Granted May 14, 2019·1 cites·19 claims
- 1969US10294324B2Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor deviceNAMICS CORP·Filed 2016·Granted May 21, 2019·1 cites·13 claims
- 2067US11472957B2Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor moduleNAMICS CORP·Filed 2017·Granted Oct 18, 2022·1 cites·18 claims
- 2164US12304818B2Porous carbon and resin compositionNAMICS CORP·Filed 2020·Granted May 20, 2025·0 cites·11 claims
- 2263US11932771B2Stretchable conductive paste and filmNAMICS CORP·Filed 2021·Granted Mar 19, 2024·0 cites·12 claims
- 2362US12534591B2Low-voltage varistor, circuit board, semiconductor component package, and interposerNAMICS CORP·Filed 2021·Granted Jan 27, 2026·0 cites·15 claims
- 2462US11466170B2Conductive pasteNAMICS CORP·Filed 2018·Granted Oct 11, 2022·0 cites·7 claims
- 2562US11316203B2Secondary battery and device including secondary batteryNAMICS CORP·Filed 2018·Granted Apr 26, 2022·0 cites·11 claims
- 2662US5714238AConductive adhesive and circuit using the sameNAMICS CORP·Filed 1996·Granted Feb 3, 1998·32 cites·16 claims
- 2762US2024059902A1Alumina composite sol composition, method for producing the same, and method for producing an alumina composite thin filmNAMICS CORP·Filed 2021·Application pending·0 cites
- 2861US11315846B2Semiconductor deviceNAMICS CORP·Filed 2018·Granted Apr 26, 2022·1 cites·7 claims
- 2960US11850625B2Syringe filled with resin composition and storage method thereforNAMICS CORP·Filed 2020·Granted Dec 26, 2023·0 cites·8 claims
- 3060US10221282B2Resin composition, adhesive agent, and sealing agentNAMICS CORP·Filed 2016·Granted Mar 5, 2019·0 cites·18 claims
- 3160US9417228B2Method of predicting viscosity behavior of thermosetting resin, simulation software, method of producing thermosetting resin, and underfill produced in the production methodNAMICS CORP·Filed 2014·Granted Aug 16, 2016·2 cites·8 claims
- 3260US6841415B2Flip chip mounting method which avoids void formation between a semiconductor chip and a substrateNAMICS CORP·Filed 2001·Granted Jan 11, 2005·10 cites·5 claims
- 3360US2010216032A1Lithium ion rechargeable battery and process for producing the lithium ion rechargeable batteryNAMICS CORP·Filed 2008·Application pending·0 cites
- 3459US7482299B2Dielectric ceramic composition and multi-layer ceramic capacitorNAMICS CORP·Filed 2006·Granted Jan 27, 2009·2 cites·4 claims
- 3558US12518889B2Conductive composition, conductive paste, electric circuit, flexible electric circuit body and method of producing molded bodyNAMICS CORP·Filed 2022·Granted Jan 6, 2026·0 cites·12 claims
- 3658US10544334B2Heat conductive paste and method for producing the sameNAMICS CORP·Filed 2016·Granted Jan 28, 2020·0 cites·18 claims
- 3758US10475938B2Process for producing conductive pastes for forming solar cell electrodesNAMICS CORP·Filed 2016·Granted Nov 12, 2019·0 cites·19 claims
- 3858US2023143754A1Photocurable resin compositionNAMICS CORP·Filed 2021·Application pending·0 cites
- 3957US7932108B2Method of preparing a sealed light-emitting diode chipNAMICS CORP·Filed 2008·Granted Apr 26, 2011·1 cites·11 claims
- 4056US12577331B2Resin compositionNAMICS CORP·Filed 2020·Granted Mar 17, 2026·0 cites·19 claims
- 4156US12384874B2Curing catalyst, resin composition, sealing material, adhesive and cured productNAMICS CORP·Filed 2020·Granted Aug 12, 2025·0 cites·11 claims
- 4256US2025154300A1Resin composition and curable resin composition using the sameNAMICS CORP·Filed 2023·Application pending·0 cites
- 4355US10800873B2Epoxy resin curing agents, epoxy resin compositions, epoxy resin cured products, and methods of producing epoxy resin curing agentNAMICS CORP·Filed 2014·Granted Oct 13, 2020·0 cites·8 claims
- 4455US9776909B2Glass fritNAMICS CORP·Filed 2014·Granted Oct 3, 2017·0 cites·21 claims
- 4555US9670377B2Underfill composition for encapsulating a bond lineNAMICS CORP·Filed 2014·Granted Jun 6, 2017·0 cites·19 claims
- 4655US2023203237A1Epoxy amine adduct, curing catalyst, resin composition, sealing material, adhesive and cured articleNAMICS CORP·Filed 2021·Application pending·0 cites
- 4754US11781236B2Composite copper foilNAMICS CORP·Filed 2018·Granted Oct 10, 2023·0 cites·10 claims
- 4854US2026055225A1Resin composition, cured product of resin composition, semiconductor device, and electronic componentNAMICS CORP·Filed 2023·Application pending·0 cites
- 4954US2013312825A1Conductive pastes for forming solar cell electrodesNAMICS CORP·Filed 2013·Application pending·0 cites
- 5053US12146014B2Curing agent composition for curing 2-methylene-1,3-dicarbonyl compoundNAMICS CORP·Filed 2019·Granted Nov 19, 2024·0 cites·14 claims
Showing the top 50 of 113 patent records by PatentIndex Score.
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