Assignee
NAKAMURA HIROKO
JP·5 granted patents·3 pending applications·9 citations·filing 2008–2012
Top patents by PatentIndex Score
8 records- 0185US8636914B2Method of forming patternNAKAMURA HIROKO·Filed 2012·Granted Jan 28, 2014·7 cites·9 claims
- 0268US9017930B2Pattern formation method and guide pattern materialNAKAMURA HIROKO·Filed 2012·Granted Apr 28, 2015·2 cites·17 claims
- 0351US8182981B2Pattern forming methodNAKAMURA HIROKO·Filed 2009·Granted May 22, 2012·0 cites·19 claims
- 0446US2008305443A1Pattern forming method using relacs processNAKAMURA HIROKO·Filed 2008·Application pending·0 cites
- 0546US2009011370A1Pattern forming method using two layers of resist patterns stacked one on top of the otherNAKAMURA HIROKO·Filed 2008·Application pending·0 cites
- 0645US8980748B2Substrate polishing method, semiconductor device and fabrication method thereforNAKAMURA HIROKO·Filed 2008·Granted Mar 17, 2015·0 cites·3 claims
- 0740US9207531B2Pattern forming methodNAKAMURA HIROKO·Filed 2011·Granted Dec 8, 2015·0 cites·24 claims
- 0836US2010317196A1Method for manufacturing semiconductor deviceNAKAMURA HIROKO·Filed 2010·Application pending·0 cites
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