Assignee
NAEM ABDALLA ALY
US·2 granted patents·2 citations·filing 2010–2011
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0164US8324097B2Method of forming a copper topped interconnect structure that has thin and thick copper tracesNAEM ABDALLA ALY·Filed 2010·Granted Dec 4, 2012·2 cites·12 claims
- 0245US8273608B1Method of forming a copper-compatible fuse targetNAEM ABDALLA ALY·Filed 2011·Granted Sep 25, 2012·0 cites·17 claims
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