Assignee
MURAYAMA KEI
JP·9 granted patents·2 pending applications·24 citations·filing 2005–2011
Top patents by PatentIndex Score
11 records- 0178US8148738B2Semiconductor device having an element mounted on a substrate and an electrical component connected to the elementMURAYAMA KEI·Filed 2007·Granted Apr 3, 2012·8 cites·12 claims
- 0273US8338289B2Method of manufacturing a semiconductor chip including a semiconductor substrate and a through via provided in a through holeMURAYAMA KEI·Filed 2010·Granted Dec 25, 2012·3 cites·17 claims
- 0368US8674499B2Heat radiation component and semiconductor package including sameMURAYAMA KEI·Filed 2011·Granted Mar 18, 2014·3 cites·5 claims
- 0465US8598684B2Semiconductor device, and method of manufacturing the sameMURAYAMA KEI·Filed 2010·Granted Dec 3, 2013·2 cites·6 claims
- 0565US8169073B2Semiconductor device and electronic apparatus of multi-chip packagingMURAYAMA KEI·Filed 2006·Granted May 1, 2012·3 cites·2 claims
- 0664US9112421B2Converter circuit including switch element unitMURAYAMA KEI·Filed 2011·Granted Aug 18, 2015·2 cites·9 claims
- 0763US8129830B2Electronic component package and method of manufacturing the same, and electronic component deviceMURAYAMA KEI·Filed 2008·Granted Mar 6, 2012·1 cites·10 claims
- 0861US8394678B2Semiconductor chip stacked body and method of manufacturing the sameMURAYAMA KEI·Filed 2009·Granted Mar 12, 2013·2 cites·21 claims
- 0945US8622556B2Frame-attached anti-reflection glass and method of manufacturing the sameMURAYAMA KEI·Filed 2011·Granted Jan 7, 2014·0 cites·5 claims
- 1042US2006138623A1Stacked-type semiconductor deviceMURAYAMA KEI·Filed 2005·Application pending·0 cites
- 1142US2006141676A1Method for producing semiconductor substrateMURAYAMA KEI·Filed 2005·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →