Assignee
MURATA SHUHEI
2 granted patents·2 pending applications·29 citations·filing 1977–2012
Top patents by PatentIndex Score
4 records- 0171US8278151B2Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chipMURATA SHUHEI·Filed 2010·Granted Oct 2, 2012·3 cites·4 claims
- 0267US4073299AThree-dimensional embroidered article and the method for the production of the sameMURATA SHUHEI·Filed 1977·Granted Feb 14, 1978·26 cites·3 claims
- 0345US2012107576A1Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chipMURATA SHUHEI·Filed 2012·Application pending·0 cites
- 0436US2012070960A1Dicing die bond film, method of manufacturing dicing die bond film, and method of manufacturing semiconductor deviceMURATA SHUHEI·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →