Assignee
MUN CHEAR-YEON
KR·1 granted patent·1 pending application·3 citations·filing 2006–2009
Top patents by PatentIndex Score
2 records- 0155US8482002B2Semiconductor device including bonding pads and semiconductor package including the semiconductor deviceMUN CHEAR-YEON·Filed 2009·Granted Jul 9, 2013·3 cites·20 claims
- 0230US2007013025A1Semiconductor memory device and method of manufacturing the sameMUN CHEAR-YEON·Filed 2006·Application pending·0 cites
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