Assignee
MORI KUNIO
JP·7 granted patents·2 pending applications·15 citations·filing 2008–2017
Top patents by PatentIndex Score
9 records- 0190US10385076B2Surface treatment agent and novel compoundMORI KUNIO·Filed 2017·Granted Aug 20, 2019·8 cites·1 claims
- 0284US9790242B2Surface treatment method, surface treatment agent, and novel compoundMORI KUNIO·Filed 2012·Granted Oct 17, 2017·5 cites·7 claims
- 0373US8062466B2Base material for adhesion and silicone rubber-adhered article using thereofMORI KUNIO·Filed 2008·Granted Nov 22, 2011·1 cites·8 claims
- 0465US9540403B2Bonding method, bondability improving agent, surface modification method, surface modifying agent, and novel compoundMORI KUNIO·Filed 2015·Granted Jan 10, 2017·0 cites·4 claims
- 0562US8753748B2Process for forming metal film, and product equipped with metal filmMORI KUNIO·Filed 2011·Granted Jun 17, 2014·0 cites·30 claims
- 0660US9593423B2Process for forming metal film, and product equipped with metal filmMORI KUNIO·Filed 2014·Granted Mar 14, 2017·1 cites·12 claims
- 0760US2011104505A1Laminated body and circuit wiring boardMORI KUNIO·Filed 2009·Application pending·0 cites
- 0860US2012028042A1Base material for adhesion and silicone rubber-adhered article using thereofMORI KUNIO·Filed 2011·Application pending·0 cites
- 0949US9238757B2Bonding method, bondability improving agent, surface modification method, surface modifying agent, and novel compoundMORI KUNIO·Filed 2011·Granted Jan 19, 2016·0 cites·22 claims
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