Assignee
MOON DONGSOO
KR·2 granted patents·26 citations·filing 2009–2011
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0189US8115293B2Integrated circuit packaging system with interconnect and method of manufacture thereofMOON DONGSOO·Filed 2009·Granted Feb 14, 2012·26 cites·20 claims
- 0239US8692365B2Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereofMOON DONGSOO·Filed 2011·Granted Apr 8, 2014·0 cites·10 claims
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