Assignee
MOMOKAWA YUUKI
JP·1 granted patent·1 pending application·0 citations·filing 2007–2008
Top patents by PatentIndex Score
2 records- 0130US8253250B2Interconnection structure of electronic device having multilayer interconnections structure with electrically conductive layersMOMOKAWA YUUKI·Filed 2008·Granted Aug 28, 2012·0 cites·6 claims
- 0227US2011005822A1Structure of a package for electronic devices and method for manufacturing the packageMOMOKAWA YUUKI·Filed 2007·Application pending·0 cites
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