Assignee
MOHAMMED ILYAS
US·18 granted patents·2 pending applications·248 citations·filing 2007–2012
Top patents by PatentIndex Score
20 records- 0198US8988895B2Interconnection elements with encased interconnectsMOHAMMED ILYAS·Filed 2011·Granted Mar 24, 2015·52 cites·23 claims
- 0298US8835228B2Substrate-less stackable package with wire-bond interconnectMOHAMMED ILYAS·Filed 2012·Granted Sep 16, 2014·54 cites·21 claims
- 0397US8946757B2Heat spreading substrate with embedded interconnectsMOHAMMED ILYAS·Filed 2012·Granted Feb 3, 2015·41 cites·16 claims
- 0497US8816505B2Low stress viasMOHAMMED ILYAS·Filed 2011·Granted Aug 26, 2014·36 cites·30 claims
- 0596US8698323B2Microelectronic assembly tolerant to misplacement of microelectronic elements thereinMOHAMMED ILYAS·Filed 2012·Granted Apr 15, 2014·27 cites·20 claims
- 0694US8742541B2High density three-dimensional integrated capacitorsMOHAMMED ILYAS·Filed 2011·Granted Jun 3, 2014·16 cites·36 claims
- 0780US8624348B2Chips with high fracture toughness through a metal ringMOHAMMED ILYAS·Filed 2011·Granted Jan 7, 2014·4 cites·29 claims
- 0875US8664681B2Parallel plate slot emission arrayMOHAMMED ILYAS·Filed 2012·Granted Mar 4, 2014·3 cites·35 claims
- 0973US8299626B2Microelectronic packageMOHAMMED ILYAS·Filed 2007·Granted Oct 30, 2012·5 cites·4 claims
- 1070US9293641B2Inverted optical deviceMOHAMMED ILYAS·Filed 2011·Granted Mar 22, 2016·2 cites·23 claims
- 1170US8890327B2Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one anotherMOHAMMED ILYAS·Filed 2011·Granted Nov 18, 2014·2 cites·18 claims
- 1269US9391008B2Reconstituted wafer-level package DRAMMOHAMMED ILYAS·Filed 2012·Granted Jul 12, 2016·2 cites·26 claims
- 1369US8975751B2Vias in porous substratesMOHAMMED ILYAS·Filed 2011·Granted Mar 10, 2015·2 cites·40 claims
- 1469US8912024B2Front facing piggyback wafer assemblyMOHAMMED ILYAS·Filed 2011·Granted Dec 16, 2014·2 cites·22 claims
- 1553US8541873B2Microelectronic packages having cavities for receiving microelectronic elementsMOHAMMED ILYAS·Filed 2011·Granted Sep 24, 2013·0 cites·16 claims
- 1648US8294284B2Package stacking through rotationMOHAMMED ILYAS·Filed 2011·Granted Oct 23, 2012·0 cites·11 claims
- 1745US9390998B2Heat spreading substrateMOHAMMED ILYAS·Filed 2012·Granted Jul 12, 2016·0 cites·25 claims
- 1843US8652935B2Void-free wafer bonding using channelsMOHAMMED ILYAS·Filed 2010·Granted Feb 18, 2014·0 cites·27 claims
- 1940US2013070437A1Hybrid interposerMOHAMMED ILYAS·Filed 2011·Application pending·0 cites
- 2040US2013068516A1High io substrates and interposers without viasMOHAMMED ILYAS·Filed 2011·Application pending·0 cites
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