Assignee
MODU TECH CO LTD
KR·2 granted patents·1 citations·filing 2019–2021
Top patents by PatentIndex Score
2 records- 0166US12275867B2Adhesive tape for semiconductor package manufacturing process and method for manufacturing sameMODU TECH CO LTD·Filed 2021·Granted Apr 15, 2025·1 cites·14 claims
- 0228US12221569B2Adhesive tape for semiconductor package manufacturing process, and method for manufacturing sameMODU TECH CO LTD·Filed 2019·Granted Feb 11, 2025·0 cites·15 claims
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