Assignee
MK ELECTRON CO LTD
US·12 granted patents·19 pending applications·34 citations·filing 1999–2025
Top patents by PatentIndex Score
31 records- 0179US11646285B2Semiconductor package using core material for reverse reflowMK ELECTRON CO LTD·Filed 2021·Granted May 9, 2023·1 cites·6 claims
- 0269US12030140B2Lead-free solder alloy and method of manufacturing electronic device using the sameMK ELECTRON CO LTD·Filed 2022·Granted Jul 9, 2024·0 cites·7 claims
- 0366US7670548B2Lead free solder containing Sn, Ag and BiMK ELECTRON CO LTD·Filed 2008·Granted Mar 2, 2010·3 cites·18 claims
- 0459US6312498B1Method of manufacturing solder ballsMK ELECTRON CO LTD·Filed 1999·Granted Nov 6, 2001·21 cites·1 claims
- 0558US2022212293A1Lead-free solder alloy, solder paste comprising the same, and semiconductor device comprising the sameMK ELECTRON CO LTD·Filed 2021·Application pending·0 cites
- 0656US8022541B2Au-Ag based alloy wire for semiconductor packageMK ELECTRON CO LTD·Filed 2007·Granted Sep 20, 2011·1 cites·17 claims
- 0754US9391039B2Solder balls and semiconductor device employing the sameMK ELECTRON CO LTD·Filed 2014·Granted Jul 12, 2016·0 cites·11 claims
- 0852US2006186544A1Copper bonding wire for semiconductor packagingMK ELECTRON CO LTD·Filed 2005·Application pending·0 cites
- 0951US6569378B2Apparatus for manufacturing solder ballsMK ELECTRON CO LTD·Filed 2001·Granted May 27, 2003·3 cites·2 claims
- 1050US9156111B2Lead free solder bumpsMK ELECTRON CO LTD·Filed 2014·Granted Oct 13, 2015·0 cites·13 claims
- 1147US2015072235A1Powder manufacturing apparatus and anode active material for secondary battery manufactured by the apparatusMK ELECTRON CO LTD·Filed 2013·Application pending·0 cites
- 1245US6700199B2Gold-silver bonding wire for semiconductor deviceMK ELECTRON CO LTD·Filed 2003·Granted Mar 2, 2004·5 cites·8 claims
- 1345US2014332716A1Anode active material for secondary battery, and secondary battery including sameMK ELECTRON CO LTD·Filed 2014·Application pending·0 cites
- 1445US2014291574A1Anode active material for secondary battery and method for manufacturing sameMK ELECTRON CO LTD·Filed 2014·Application pending·0 cites
- 1545US2015041707A1Negative active material for secondary battery and method of manufacturing the sameMK ELECTRON CO LTD·Filed 2013·Application pending·0 cites
- 1645US2021375811A1Pin-grid-array-type semiconductor packageMK ELECTRON CO LTD·Filed 2021·Application pending·0 cites
- 1744US2014203207A1Anode active material for secondary battery and method of manufacturing the sameMK ELECTRON CO LTD·Filed 2013·Application pending·0 cites
- 1843US8716860B2Tin-based solder ball and semiconductor package including the sameMK ELECTRON CO LTD·Filed 2012·Granted May 6, 2014·0 cites·14 claims
- 1943US2014023928A1Anode active material for secondary battery and secondary battery including the sameMK ELECTRON CO LTD·Filed 2012·Application pending·0 cites
- 2041US2014199594A1Anode active material for secondary battery and method of manufacturing the sameMK ELECTRON CO LTD·Filed 2013·Application pending·0 cites
- 2141US2025226344A1Core ball and semiconductor package including the sameMK ELECTRON CO LTD·Filed 2025·Application pending·0 cites
- 2241US2008230915A1SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOYMK ELECTRON CO LTD·Filed 2008·Application pending·0 cites
- 2341US2008240975A1Ag-based alloy wire for semiconductor packageMK ELECTRON CO LTD·Filed 2008·Application pending·0 cites
- 2440US2015064293A1Metal ball fabricating apparatusMK ELECTRON CO LTD·Filed 2014·Application pending·0 cites
- 2538US2014284794A1Tin-based solder ball and semiconductor package including the sameMK ELECTRON CO LTD·Filed 2012·Application pending·0 cites
- 2637US7250135B2Pb-free solder alloyMK ELECTRON CO LTD·Filed 2005·Granted Jul 31, 2007·0 cites·2 claims
- 2736US6991854B2Gold alloy bonding wire for semiconductor deviceMK ELECTRON CO LTD·Filed 2003·Granted Jan 31, 2006·0 cites·9 claims
- 2835US2016244891A1Solder ball for fluxless bonding, method of manufacturing the same, and method of forming solder bumpMK ELECTRON CO LTD·Filed 2016·Application pending·0 cites
- 2934US2006251538A1Au alloy bonding wireMK ELECTRON CO LTD·Filed 2006·Application pending·0 cites
- 3026US2016315040A1Core for reverse reflow, semiconductor package, and method of fabricating semiconductor packageMK ELECTRON CO LTD·Filed 2016·Application pending·0 cites
- 3126US2016256962A1Lead-free solder having low melting pointMK ELECTRON CO LTD·Filed 2016·Application pending·0 cites
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