Assignee
MISHIMA HIDEHIKO
JP·1 granted patent·3 pending applications·3 citations·filing 2006–2011
Top patents by PatentIndex Score
4 records- 0157US8268182B2Product having through-hole and laser processing methodMISHIMA HIDEHIKO·Filed 2007·Granted Sep 18, 2012·3 cites·3 claims
- 0244US2011318530A1Product having through-hole and laser processing methodMISHIMA HIDEHIKO·Filed 2011·Application pending·0 cites
- 0340US2011211368A1Light guide plate, wiring module and electronic applianceMISHIMA HIDEHIKO·Filed 2009·Application pending·0 cites
- 0439US2009152246A1Method for Processing Material by Laser Ablation and Material Processed by Processing Method ThereofMISHIMA HIDEHIKO·Filed 2006·Application pending·0 cites
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