Assignee
MICROELECTRONIC PACKAGING INC
US·4 granted patents·104 citations·filing 1989–1996
Top patents by PatentIndex Score
4 records- 0175US5680685AMethod of fabricating a multilayer ceramic capacitorMICROELECTRONIC PACKAGING INC·Filed 1995·Granted Oct 28, 1997·43 cites·12 claims
- 0267US5603147AMethod of making a high energy multilayer ceramic capacitorMICROELECTRONIC PACKAGING INC·Filed 1995·Granted Feb 18, 1997·34 cites·10 claims
- 0362US5808856AHigh energy multilayer ceramic capacitorMICROELECTRONIC PACKAGING INC·Filed 1996·Granted Sep 15, 1998·25 cites·20 claims
- 0414US5013347AGlass bonding methodMICROELECTRONIC PACKAGING INC·Filed 1989·Granted May 7, 1991·2 cites·2 claims
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