Assignee
MEYER-BERG GEORG
DE·12 granted patents·3 pending applications·36 citations·filing 2008–2012
Top patents by PatentIndex Score
15 records- 0194US8183677B2Device including a semiconductor chipMEYER-BERG GEORG·Filed 2008·Granted May 22, 2012·26 cites·17 claims
- 0272US8338231B2Encapsulated semiconductor chip with external contact pads and manufacturing method thereofMEYER-BERG GEORG·Filed 2010·Granted Dec 25, 2012·3 cites·22 claims
- 0367US9159777B2Die arrangements containing an inductor coil and methods of manufacturing a die arrangement containing an inductor coilMEYER-BERG GEORG·Filed 2011·Granted Oct 13, 2015·2 cites·22 claims
- 0466US8124449B2Device including a semiconductor chip and metal foilsMEYER-BERG GEORG·Filed 2008·Granted Feb 28, 2012·3 cites·23 claims
- 0562US8193040B2Manufacturing of a device including a semiconductor chipMEYER-BERG GEORG·Filed 2010·Granted Jun 5, 2012·1 cites·33 claims
- 0661US8680668B2Device including a semiconductor chip and metal foilsMEYER-BERG GEORG·Filed 2012·Granted Mar 25, 2014·1 cites·25 claims
- 0753US9111847B2Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level packageMEYER-BERG GEORG·Filed 2012·Granted Aug 18, 2015·0 cites·29 claims
- 0852US8669175B2Semiconductor device and manufacturing of the semiconductor deviceMEYER-BERG GEORG·Filed 2012·Granted Mar 11, 2014·0 cites·18 claims
- 0952US8264085B2Semiconductor device package interconnectionsMEYER-BERG GEORG·Filed 2008·Granted Sep 11, 2012·0 cites·14 claims
- 1048US2012231582A1Device including a semiconductor chipMEYER-BERG GEORG·Filed 2012·Application pending·0 cites
- 1147US2010207227A1Electronic Device and Method of Manufacturing SameMEYER-BERG GEORG·Filed 2009·Application pending·0 cites
- 1243US9105562B2Integrated circuit package and packaging methodsMEYER-BERG GEORG·Filed 2011·Granted Aug 11, 2015·0 cites·11 claims
- 1341US9269685B2Integrated circuit package and packaging methodsMEYER-BERG GEORG·Filed 2011·Granted Feb 23, 2016·0 cites·24 claims
- 1441US9123544B2Semiconductor device and methodMEYER-BERG GEORG·Filed 2011·Granted Sep 1, 2015·0 cites·13 claims
- 1540US2013087371A1Electronic packaging connector and methods for its productionMEYER-BERG GEORG·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when MEYER-BERG GEORG files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →