Assignee
METROSPEC TECHNOLOGY LLC
US·3 granted patents·167 citations·filing 2009–2015
Top patents by PatentIndex Score
3 records- 0197US8007286B1Circuit boards interconnected by overlapping plated through holes portionsMETROSPEC TECHNOLOGY LLC·Filed 2009·Granted Aug 30, 2011·76 cites·20 claims
- 0297US7980863B1Printed circuit board flexible interconnect designMETROSPEC TECHNOLOGY LLC·Filed 2009·Granted Jul 19, 2011·81 cites·16 claims
- 0394US9357639B2Circuit board having a plated through hole through a conductive padMETROSPEC TECHNOLOGY LLC·Filed 2015·Granted May 31, 2016·10 cites·20 claims
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