Assignee

MERCK ELECTRONICS LTD

JP·0 granted patents·1 pending application·0 citations·filing 2024–2024

Technology mixC08F1 C23C1 G03F1 H01L1 H10P1 H10W1

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1 record

0157US2025021004A1Ion implantation thick film resist composition, a method for manufacturing a processed substrate using the same, and a method for manufacturing a device using the sameMERCK ELECTRONICS LTD·Filed 2024·Application pending·0 cites

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