Assignee
MEMC ELECTRONIC MATERIALS SPA
IT·11 granted patents·4 pending applications·520 citations·filing 1991–2013
Top patents by PatentIndex Score
15 records- 0194US5994761AIdeal oxygen precipitating silicon wafers and oxygen out-diffusion-less process thereforMEMC ELECTRONIC MATERIALS SPA·Filed 1997·Granted Nov 30, 1999·122 cites·67 claims
- 0289US6306733B1Ideal oxygen precipitating epitaxial silicon wafers and oxygen out-diffusion-less process thereforMEMC ELECTRONIC MATERIALS SPA·Filed 2000·Granted Oct 23, 2001·33 cites·25 claims
- 0384US5401669AProcess for the preparation of silicon wafers having controlled distribution of oxygen precipitate nucleation centersMEMC ELECTRONIC MATERIALS SPA·Filed 1993·Granted Mar 28, 1995·101 cites·25 claims
- 0483US6204152B1Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process thereforMEMC ELECTRONIC MATERIALS SPA·Filed 1999·Granted Mar 20, 2001·43 cites·54 claims
- 0583US5403406ASilicon wafers having controlled precipitation distributionMEMC ELECTRONIC MATERIALS SPA·Filed 1991·Granted Apr 4, 1995·99 cites·6 claims
- 0682US6537368B2Ideal oxygen precipitating epitaxial silicon wafers and oxygen out-diffusion-less process thereforMEMC ELECTRONIC MATERIALS SPA·Filed 2001·Granted Mar 25, 2003·18 cites·18 claims
- 0781US7223344B2Method for treating an exhausted glycol-based slurryMEMC ELECTRONIC MATERIALS SPA·Filed 2001·Granted May 29, 2007·35 cites·31 claims
- 0876US7137874B1Semiconductor wafer, polishing apparatus and methodMEMC ELECTRONIC MATERIALS SPA·Filed 2000·Granted Nov 21, 2006·25 cites·30 claims
- 0966US6878302B1Method of polishing wafersMEMC ELECTRONIC MATERIALS SPA·Filed 2000·Granted Apr 12, 2005·15 cites·17 claims
- 1066US6803576B2Analytical method to measure nitrogen concentration in single crystal siliconMEMC ELECTRONIC MATERIALS SPA·Filed 2002·Granted Oct 12, 2004·9 cites·58 claims
- 1159US2013327506A1Method for transferring heat between two process streamsMEMC ELECTRONIC MATERIALS SPA·Filed 2013·Application pending·0 cites
- 1252US5272119AProcess for contamination removal and minority carrier lifetime improvement in siliconMEMC ELECTRONIC MATERIALS SPA·Filed 1992·Granted Dec 21, 1993·20 cites·22 claims
- 1341US2013174828A1Systems and Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire SawMEMC ELECTRONIC MATERIALS SPA·Filed 2012·Application pending·0 cites
- 1438US2013000672A1Cleaning tool for polysilicon reactorMEMC ELECTRONIC MATERIALS SPA·Filed 2012·Application pending·0 cites
- 1532US2013014738A1Saw For Cutting Silicon Into Seed Rods For Use In A Chemical Vapor Deposition Polysilicon ReactorMEMC ELECTRONIC MATERIALS SPA·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →