Assignee
MEGIC CORP
TW·46 granted patents·4 pending applications·3,617 citations·filing 2000–2008
Top patents by PatentIndex Score
50 records- 0199US6818545B2Low fabrication cost, fine pitch and high reliability solder bumpMEGIC CORP·Filed 2001·Granted Nov 16, 2004·271 cites·35 claims
- 0299US6495442B1Post passivation interconnection schemes on top of the IC chipsMEGIC CORP·Filed 2000·Granted Dec 17, 2002·207 cites·23 claims
- 0399US6303423B1Method for forming high performance system-on-chip using post passivation processMEGIC CORP·Filed 2000·Granted Oct 16, 2001·272 cites·35 claims
- 0498US6759275B1Method for making high-performance RF integrated circuitsMEGIC CORP·Filed 2001·Granted Jul 6, 2004·175 cites·11 claims
- 0598US6649509B1Post passivation metal scheme for high-performance integrated circuit devicesMEGIC CORP·Filed 2001·Granted Nov 18, 2003·156 cites·110 claims
- 0698US6605528B1Post passivation metal scheme for high-performance integrated circuit devicesMEGIC CORP·Filed 2001·Granted Aug 12, 2003·151 cites·69 claims
- 0798US6455885B1Inductor structure for high performance system-on-chip using post passivation processMEGIC CORP·Filed 2001·Granted Sep 24, 2002·178 cites·21 claims
- 0897US7045901B2Chip-on-chip connection with second chip located in rectangular open window hole in printed circuit boardMEGIC CORP·Filed 2003·Granted May 16, 2006·91 cites·8 claims
- 0997US6917119B2Low fabrication cost, high performance, high reliability chip scale packageMEGIC CORP·Filed 2003·Granted Jul 12, 2005·106 cites·10 claims
- 1097US6756295B2Chip structure and process for forming the sameMEGIC CORP·Filed 2002·Granted Jun 29, 2004·141 cites·35 claims
- 1197US6734563B2Post passivation interconnection schemes on top of the IC chipsMEGIC CORP·Filed 2002·Granted May 11, 2004·79 cites·23 claims
- 1297US6673698B1Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layersMEGIC CORP·Filed 2002·Granted Jan 6, 2004·100 cites·15 claims
- 1397US6642136B1Method of making a low fabrication cost, high performance, high reliability chip scale packageMEGIC CORP·Filed 2001·Granted Nov 4, 2003·123 cites·36 claims
- 1497US6426556B1Reliable metal bumps on top of I/O pads with test probe marksMEGIC CORP·Filed 2001·Granted Jul 30, 2002·177 cites·66 claims
- 1596US6746898B2Integrated chip package structure using silicon substrate and method of manufacturing the sameMEGIC CORP·Filed 2002·Granted Jun 8, 2004·99 cites·60 claims
- 1695US6350705B1Wafer scale packaging schemeMEGIC CORP·Filed 2000·Granted Feb 26, 2002·83 cites·14 claims
- 1794US6800941B2Integrated chip package structure using ceramic substrate and method of manufacturing the sameMEGIC CORP·Filed 2002·Granted Oct 5, 2004·76 cites·16 claims
- 1894US6798073B2Chip structure and process for forming the sameMEGIC CORP·Filed 2003·Granted Sep 28, 2004·78 cites·108 claims
- 1994US6768208B2Multiple chips bonded to packaging structure with low noise and multiple selectable functionsMEGIC CORP·Filed 2003·Granted Jul 27, 2004·52 cites·4 claims
- 2094US6762115B2Chip structure and process for forming the sameMEGIC CORP·Filed 2002·Granted Jul 13, 2004·90 cites·34 claims
- 2194US6515369B1High performance system-on-chip using post passivation processMEGIC CORP·Filed 2002·Granted Feb 4, 2003·90 cites·10 claims
- 2293US6815324B2Reliable metal bumps on top of I/O pads after removal of test probe marksMEGIC CORP·Filed 2001·Granted Nov 9, 2004·70 cites·28 claims
- 2393US6593649B1Methods of IC rerouting option for multiple package system applicationsMEGIC CORP·Filed 2001·Granted Jul 15, 2003·77 cites·30 claims
- 2493US6586266B1High performance sub-system design and assemblyMEGIC CORP·Filed 2001·Granted Jul 1, 2003·66 cites·13 claims
- 2592US6869870B2High performance system-on-chip discrete components using post passivation processMEGIC CORP·Filed 2003·Granted Mar 22, 2005·57 cites·33 claims
- 2692US6784087B2Method of fabricating cylindrical bonding structureMEGIC CORP·Filed 2002·Granted Aug 31, 2004·60 cites·23 claims
- 2792US6489647B1Capacitor for high performance system-on-chip using post passivation process structureMEGIC CORP·Filed 2002·Granted Dec 3, 2002·59 cites·7 claims
- 2890US6620728B2Top layers of metal for high performance IC'sMEGIC CORP·Filed 2002·Granted Sep 16, 2003·55 cites·42 claims
- 2990US6495912B1Structure of ceramic package with integrated passive devicesMEGIC CORP·Filed 2001·Granted Dec 17, 2002·64 cites·38 claims
- 3090US6399997B1High performance system-on-chip using post passivation process and glass substratesMEGIC CORP·Filed 2000·Granted Jun 4, 2002·60 cites·40 claims
- 3185US7205646B2Electronic device and chip packageMEGIC CORP·Filed 2003·Granted Apr 17, 2007·20 cites·34 claims
- 3285US6700162B2Chip structure to improve resistance-capacitance delay and reduce energy loss of the chipMEGIC CORP·Filed 2003·Granted Mar 2, 2004·35 cites·121 claims
- 3384US6897507B2Capacitor for high performance system-on-chip using post passivation deviceMEGIC CORP·Filed 2002·Granted May 24, 2005·29 cites·21 claims
- 3483US6936531B2Process of fabricating a chip structureMEGIC CORP·Filed 2003·Granted Aug 30, 2005·17 cites·34 claims
- 3583US6489656B1Resistor for high performance system-on-chip using post passivation processMEGIC CORP·Filed 2002·Granted Dec 3, 2002·31 cites·9 claims
- 3681US6791192B2Multiple chips bonded to packaging structure with low noise and multiple selectable functionsMEGIC CORP·Filed 2003·Granted Sep 14, 2004·16 cites·8 claims
- 3778US6806570B1Thermal compliant semiconductor chip wiring structure for chip scale packagingMEGIC CORP·Filed 2002·Granted Oct 19, 2004·30 cites·20 claims
- 3876US6939747B1Multiple selectable function integrated circuit moduleMEGIC CORP·Filed 2001·Granted Sep 6, 2005·13 cites·20 claims
- 3973US6802945B2Method of metal sputtering for integrated circuit metal routingMEGIC CORP·Filed 2003·Granted Oct 12, 2004·10 cites·73 claims
- 4066US6387801B1Method and an apparatus to electroless plate a metal layer while eliminating the photoelectric effectMEGIC CORP·Filed 2000·Granted May 14, 2002·6 cites·20 claims
- 4165US7288845B2Fabrication of wire bond pads over underlying active devices, passive devices and/or dielectric layers in integrated circuitsMEGIC CORP·Filed 2003·Granted Oct 30, 2007·12 cites·28 claims
- 4263US6768194B2Electrode for electroplating planar structuresMEGIC CORP·Filed 2003·Granted Jul 27, 2004·4 cites·18 claims
- 4363US6638840B1Electrode for electroplating planar structuresMEGIC CORP·Filed 2001·Granted Oct 28, 2003·4 cites·6 claims
- 4461US6809935B1Thermally compliant PCB substrate for the application of chip scale packagesMEGIC CORP·Filed 2000·Granted Oct 26, 2004·10 cites·52 claims
- 4558US6399975B1Wide bit memory using post passivation interconnection schemeMEGIC CORP·Filed 2001·Granted Jun 4, 2002·15 cites·20 claims
- 4657US6522009B2Apparatus to electroless plate a metal layer while eliminating the photo electric effectMEGIC CORP·Filed 2002·Granted Feb 18, 2003·2 cites·19 claims
- 4754US2008188071A1Low fabrication cost, fine pitch and high reliability solder bumpMEGIC CORP·Filed 2008·Application pending·0 cites
- 4850US2005040033A1Method of metal sputtering for integrated circuit metal routingMEGIC CORP·Filed 2004·Application pending·0 cites
- 4942US2004063249A1Thin film semiconductor package and method of fabricationMEGIC CORP·Filed 2003·Application pending·0 cites
- 5036US2005186690A1Method for improving semiconductor wafer test accuracyMEGIC CORP·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when MEGIC CORP files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →