Assignee
MCSP LLC
US·5 granted patents·237 citations·filing 1998–2005
Technology mixH10W5
Top patents by PatentIndex Score
5 records- 0194US6982475B1Hermetic wafer scale integrated circuit structureMCSP LLC·Filed 2002·Granted Jan 3, 2006·118 cites·23 claims
- 0292US6753208B1Wafer scale method of packaging integrated circuit dieMCSP LLC·Filed 2002·Granted Jun 22, 2004·84 cites·9 claims
- 0389US7205181B1Method of forming hermetic wafer scale integrated circuit structureMCSP LLC·Filed 2005·Granted Apr 17, 2007·19 cites·37 claims
- 0482US7205635B1Hermetic wafer scale integrated circuit structureMCSP LLC·Filed 2005·Granted Apr 17, 2007·11 cites·10 claims
- 0534US7215025B1Wafer scale semiconductor structureMCSP LLC·Filed 1998·Granted May 8, 2007·5 cites·10 claims
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